Patents by Inventor Francois-Charles Dary

Francois-Charles Dary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Corrosion-resistant glass melt electrodes and methods of using them
    Patent number: 11814312
    Abstract: In various embodiments, refractory-metal glass melt electrodes are single-crystalline, at least within an outer layer thereof.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: November 14, 2023
    Assignee: H.C. Starck Solutions Coldwater, LLC
    Inventors: Paul Aimone, WenDi Liu, Maria Bozena Winnicka, Francois-Charles Dary
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 11640222
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 13, 2022
    Date of Patent: May 2, 2023
    Assignee: Materion Newton, Inc.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20220308705
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: June 13, 2022
    Publication date: September 29, 2022
    Inventors: Shuwei SUN, Francois-Charles DARY, Marc ABOUAF, Patrick HOGAN, Qi ZHANG
  • Fabrication of reinforced superconducting wires
    Patent number: 11417445
    Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: August 16, 2022
    Assignee: H.C. Starck Solutions Coldwater, LLC
    Inventors: Paul Aimone, Francois-Charles Dary, David B. Smathers
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 11392257
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: January 8, 2021
    Date of Patent: July 19, 2022
    Assignee: MATERION NEWTON INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20210208738
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: January 8, 2021
    Publication date: July 8, 2021
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • Thin-film transistor and method of forming an electrode of a thin-film transistor
    Patent number: 10916569
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: February 9, 2021
    Assignee: H.C. STARCK INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • FABRICATION OF REINFORCED SUPERCONDUCTING WIRES
    Publication number: 20200365295
    Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 19, 2020
    Inventors: Paul AIMONE, Francois-Charles DARY, David B. SMATHERS
  • CORROSION-RESISTANT GLASS MELT ELECTRODES AND METHODS OF USING THEM
    Publication number: 20200262730
    Abstract: In various embodiments, refractory-metal glass melt electrodes are single-crystalline, at least within an outer layer thereof.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 20, 2020
    Inventors: Paul AIMONE, WenDi LIU, Maria Bozena WINNICKA, Francois-Charles DARY
  • Fabrication of reinforced superconducting wires
    Patent number: 10679775
    Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
    Type: Grant
    Filed: July 17, 2018
    Date of Patent: June 9, 2020
    Assignee: H.C. STARCK INC.
    Inventors: Paul Aimone, Francois-Charles Dary, David B. Smathers
  • Corrosion-resistant glass melt electrodes and methods of using them
    Patent number: 10604434
    Abstract: In various embodiments, refractory-metal glass melt electrodes are single-crystalline, at least within an outer layer thereof.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: March 31, 2020
    Assignee: H.C. STARCK INC.
    Inventors: Paul Aimone, WenDi Liu, Maria Bozena Winnicka, Francois-Charles Dary
  • FABRICATION OF REINFORCED SUPERCONDUCTING WIRES
    Publication number: 20180374612
    Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
    Type: Application
    Filed: July 17, 2018
    Publication date: December 27, 2018
    Inventors: Paul AIMONE, Francois-Charles DARY, David B. SMATHERS
  • Fabrication of reinforced superconducting wires
    Patent number: 10049793
    Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
    Type: Grant
    Filed: July 8, 2016
    Date of Patent: August 14, 2018
    Assignee: H.C. STARCK INC.
    Inventors: Paul Aimone, Francois-Charles Dary, David B. Smathers
  • COPPER-ALLOY CAPPING LAYERS FOR METALLIZATION IN TOUCH-PANEL DISPLAYS
    Publication number: 20180175075
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: February 13, 2018
    Publication date: June 21, 2018
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • Copper-alloy capping layers for metallization in touch-panel displays
    Patent number: 9929187
    Abstract: In various embodiments, electronic devices such as touch-panel displays incorporate interconnects featuring a conductor layer and, disposed above the conductor layer, a capping layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: March 27, 2018
    Assignee: H.C. STARCK INC.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • FABRICATION OF REINFORCED SUPERCONDUCTING WIRES
    Publication number: 20170309375
    Abstract: In various embodiments, superconducting wires feature assemblies of clad composite filaments and/or stabilized composite filaments embedded within a wire matrix. The wires may include one or more stabilizing elements for improved mechanical properties.
    Type: Application
    Filed: July 8, 2016
    Publication date: October 26, 2017
    Inventors: Paul AIMONE, Francois-Charles DARY, David B. SMATHERS
  • Large-area sputtering targets
    Patent number: 9412568
    Abstract: In various embodiments, joined sputtering targets are formed at least in part by spray deposition of the sputtering material and/or welding.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: August 9, 2016
    Assignee: H.C. Starck, Inc.
    Inventors: Francois-Charles Dary, Mark Gaydos, William Loewenthal, Steven A. Miller, Gary Rozak, Scott Jeffrey Volchko, Stefan Zimmermann, Michael Thomas Stawovy
  • COPPER-ALLOY BARRIER LAYERS FOR METALLIZATION IN THIN-FILM TRANSISTORS AND FLAT PANEL DISPLAYS
    Publication number: 20160172386
    Abstract: In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Application
    Filed: February 19, 2016
    Publication date: June 16, 2016
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang
  • CORROSION-RESISTANT GLASS MELT ELECTRODES AND METHODS OF USING THEM
    Publication number: 20160096763
    Abstract: In various embodiments, refractory-metal glass melt electrodes are single-crystalline, at least within an outer layer thereof.
    Type: Application
    Filed: October 1, 2015
    Publication date: April 7, 2016
    Inventors: Paul Aimone, WenDi Liu, Maria Bozena Winnicka, Francois-Charles Dary
  • Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displays
    Patent number: 9299472
    Abstract: In various embodiments, electronic devices such as thin-film transistors incorporate electrodes featuring a conductor layer and, disposed below the conductor layer, a barrier layer comprising an alloy of Cu and one or more refractory metal elements selected from the group consisting of Ta, Nb, Mo, W, Zr, Hf, Re, Os, Ru, Rh, Ti, V, Cr, and Ni.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: March 29, 2016
    Assignee: H.C. Starck Inc.
    Inventors: Shuwei Sun, Francois-Charles Dary, Marc Abouaf, Patrick Hogan, Qi Zhang