Abstract: A document (10) comprises a multilayer structure (18) formed by at least two layers (20, 22, 34) assembled together and a near-field communication device (24) incorporated in the thickness of the structure (18). More particularly, the device (24) is in the form of a module (26) comprising a support (28) bearing a near-field communication antenna (30) and a microcircuit (32) and the module (26) comprises an embrittlement zone (46) capable of breaking during separation of the two layers (20, 22, 34) to cause destruction of the module (26).

Abstract: The inlay (10) for the manufacture of a device (12) comprising a base made up of a multilayer structure within which the inlay (10) is designed to be incorporated, the insert (10) comprising a microcircuit and an antenna connected to the microcircuit. The transponder assembly is combined into a microcircuit module (26) and the substrate includes a cavity (28) dimensioned to completely receive the module (26).

Abstract: The contactless electronic device (12) comprising a near-field communication antenna (18), a microcircuit (20) connected to the antenna (18) and a magnetic shielding layer (24) arranged so as to extend substantially facing the antenna (18). The antenna (18) and the microcircuit (20) are combined into a module (26) and the device (12) comprises a body (16) comprising and open cavity (30) on one of its faces in which are housed the module and the shielding layer in such a way that the shielding layer closes off the cavity.

Abstract: The electronic device (10) comprising a microcircuit (18) module (20), a near-field communication antenna (36) electrically connected to the microcircuit (18) of the module (20), delimiting an antenna surface (S), and a body (12) incorporating the module (20). More precisely, the antenna (36) is arranged within the module (20) and the body (12) incorporates means (40) of amplifying the gain of the antenna (36) comprising an electrically conductive element (42) electrically isolated from the microcircuit (18) and the antenna (36), of an annular general shape arranged around an area (R) of the body (12) forming a volume generated by the projection of the antenna surface (S) along a direction (Z) substantially orthogonal to the surface (S).

Abstract: The device (10) includes a near-field communication antenna (12) delimiting a useful magnetic field receiving area (S), a microcircuit (14) connected to the antenna (12) and a magnetic shielding layer (16) arranged so as to extend at least partially under the area (S). It also includes a support (18) built into a microcircuit card body (20) including an open cavity (30) in one of its faces (F2) extending at least partially under the antenna area (S) and sized so as to completely accommodate the shielding layer (16). More specifically, the body (20) includes a detachable plate (22) within which are arranged the antenna (12) and the microcircuit (14) and within which the layer (16) extends at least partially.

Abstract: A secure electronic entity comprising a support and a microcircuit having an active surface which is at least partially covered by a resin, wherein at least one distinct element masks the active surface in an at least partial manner, characterized in that the element (13) is joined to the resin (16) in a more resistant manner than to the support (11).

Abstract: A method for production of a microcircuit card, includes the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which the connector pins are arranged and production of a module including a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of the film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerized.

Abstract: A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) so that it is markedly higher than its adherence on the module (22).

Abstract: A smart card comprises a magnetic antenna consisting of first (26) and second (28) coils. The card embossing area (24) is arranged outside of the first coil (26) and inside the second coil (28). A smart card producing method is also disclosed.

Abstract: A method for producing a number of chip cards includes a step for preparing a supporting film comprising a number of locations each of which constituting a card support and being provided with a cavity capable of receiving an integrated circuit, a step for processing this supporting film carried out, in part, by a multi-head tool, one of the heads of this tool being provided for carrying out an operation on a location of the film essentially at the same time as another head of this tool carries out the same operation on another location of this film, and a step for separating the locations after the processing step.

Abstract: The invention relates to a method for producing a microcircuit card, comprising the following steps: a step for positioning a microcircuit in an open-cavity mould, and a step for depositing a material in the open cavity of the mould, the material being sufficiently poorly viscous for coating at least indirectly at least part of the microcircuit.

Abstract: A secure electronic entity comprising a support and a microcircuit having an active surface which is at least partially covered by a resin, wherein at least one distinct element masks the active surface in an at least partial manner, characterized in that the element (13) is joined to the resin (16) in a more resistant manner than to the support (11).

Abstract: A smart card includes: a plastic body, a module integral with the body and including a support bearing external electric connection pads, at least one electronic chip borne by the support and having one side called active surface bearing internal electric connection pads, and runs electrically connecting the external and internal electric connection pads, respectively. The invention is characterized in that at least one of the runs includes a conductor strip which is configured and arranged so as to project above the active surface while concealing at least a substantial part with at least one large-sized portion and has at least one small-sized portion adapted to involve easy disconnection by rupture upon displacement of the strip or elimination of all or part of the strip relative to the active surface.

Abstract: A method for production of a microcircuit card, includes the production of a card with electronic component connector pins for an electronic component within the thickness thereof and provided with a cavity with a base and defined by a slope on which the connector pins are arranged and production of a module including a support film with external contacts on an external face thereof and internal contacts on an internal face thereof. An anisotropic flexible conducting adhesive is then applied to the periphery of the internal face of the film, a resin more rigid than the adhesive is introduced into the cavity of the body, the module is inserted into the cavity such that the anisotropic adhesive is located opposite the periphery of the slope of the cavity, the anisotropic adhesive is thermally activated under pressure and the resin polymerized.

Abstract: The invention concerns a smart card comprising a microcircuit, at least one other component including a protruding component and external contacts in a card-holder. The invention is characterized in that the microcircuit (1), the protruding component (2) and the external contacts (12) form part of a subassembly (S1) fixed in a housing (C1+C2+C3) provided in part of the thickness of the card-holder, said subassembly including a support film (10) bearing on one inner surface the microcircuit (1) and at least the protruding component (2) and on one outer surface the external contacts (12), a window (11) being arranged in said film opposite part of the projecting component.

Abstract: A smart card includes: a plastic body, a module integral with the body and including a support bearing external electric connection pads, at least one electronic chip borne by the support and having one side called active surface bearing internal electric connection pads, and runs electrically connecting the external and internal electric connection pads, respectively. The invention is characterized in that at least one of the runs includes a conductor strip which is configured and arranged so as to project above the active surface while concealing at least a substantial part with at least one large-sized portion and has at least one small-sized portion adapted to involve easy disconnection by rupture upon displacement of the strip or elimination of all or part of the strip relative to the active surface.

Abstract: A method for mounting a microcircuit module in a card body to make the card non-detachable without damage includes fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) so that it is markedly higher than its adherence on the module (22).

Abstract: To mount a microcircuit module in a cavity in a card forming a support, resin is deposited on the bottom of the cavity and the module is fitted in such a way that the microcircuit is coated with resin. A compressible annular area formed in the cavity completely surrounds the microcircuit and the coating material. The annular area extends over a continuous peripheral area of the bottom of the cavity.

Abstract: A method of fabricating a microcircuit card provides better control of the spreading of a hardenable coating material during fabrication of the microcircuit card. The surface of a support is treated to define at least two areas with different surface states and both extending beyond a predetermined location of the microcircuit. The deposit of the material is delimited by the configuration of these areas. The treatment is preferably applied by means of a laser beam.

Abstract: Integrated circuit board combining external contact zones and an antenna to receive data transmitted by a terminal, and process for manufacturing such a board. The integrated circuit board in accordance with the invention comprises a single integrated circuit connected both to an antenna by connection terminals and to external contact zones by other connection terminals; the antenna is arranged between a support and a strip; the above-mentioned connection terminals are arranged opposite the corresponding connection ends of the integrated circuit and are respectively connected to them; the integrated circuit is arranged by a process know by the name “flip-chip” in a cavity in which the connection terminals of the antenna and those of the external contact zones are accessible. The board in accordance with the invention may by used both with a reader connected to the external contact zones or with a terminal transmitting data without contacts, by means of the antenna.