Abstract: Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip. The at least one of the plurality of leads that is not configured to mechanically coupled at the surface of the semiconductor chip be configured to electrically couple with the semiconductor chip.

Abstract: A method for controlling power delivery from a transmitter to a receiver, comprising generating a control at a processor to actuate a distance measurement device. Transmitting the control to the distance measurement device. Activating the distance measurement device to measure a distance between a transmitter and a receiver. Transmitting a data packet from the distance measurement device to the processor that contains a plurality of data fields that have a value that represents the distance. Determining whether the distance is less than a predetermined threshold using the processor. Generating an error signal if the distance is less than the predetermined threshold to prevent the transmitter from generating an electromagnetic field that would cause damage to the receiver. Setting a ping signal strength as a function of the distance. Generating an electromagnetic field as a function of the ping signal strength.

Abstract: A method for controlling power delivery from a transmitter to a receiver, comprising generating a control at a processor to actuate a distance measurement device. Transmitting the control to the distance measurement device. Activating the distance measurement device to measure a distance between a transmitter and a receiver. Transmitting a data packet from the distance measurement device to the processor that contains a plurality of data fields that have a value that represents the distance. Determining whether the distance is less than a predetermined threshold using the processor. Generating an error signal if the distance is less than the predetermined threshold to prevent the transmitter from generating an electromagnetic field that would cause damage to the receiver. Setting a ping signal strength as a function of the distance. Generating an electromagnetic field as a function of the ping signal strength.

Abstract: Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip.

Abstract: Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip. The at least one of the plurality of leads that is not configured to mechanically coupled at the surface of the semiconductor chip be configured to electrically couple with the semiconductor chip.

Abstract: Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip.

Abstract: Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip. The at least one of the plurality of leads that is not configured to mechanically coupled at the surface of the semiconductor chip be configured to electrically couple with the semiconductor chip.

Abstract: Leadframes for semiconductor packages. Implementations may include a plurality of leads extending inwardly into an opening surrounded by the plurality of leads where the plurality of leads except for at least one are configured to mechanically couple at a surface of a semiconductor chip.

Abstract: A method for determining r error detection bits that can be associated with a word of m bits to be coded, including the step of calculating the product of a vector with m components representative of the word of m bits to be coded and of a parity control matrix of dimension r×m. The parity control matrix is such that each column of matrix includes an odd number of “1s” greater than or equal to three. The present invention also relates to a method for determining a syndrome.

Abstract: A method for determining r error detection bits that can be associated with a word of m bits to be coded, including the step of calculating the product of a vector with m components representative of the word of m bits to be coded and of a parity control matrix of dimension r×m. The parity control matrix is such that each column of matrix includes an odd number of “1s” greater than or equal to three. The present invention also relates to a method for determining a syndrome.