Abstract: The rack (4), which is provided to receive electronic module that can be plugged in, has a modular construction and comprises at least two rack modules (21), each rack module (21) defining a cell (8) for receiving at least one electronic module (6), each rack module (21) having at least a side wall (22), a lower wall (24) and a rear wall (26) defining the cell (8), the lower wall (24) being configured to ensure a distribution of air inside the cell (8), the rear wall (26) being provided with connector openings (32) for fastening rack connectors (20) provided to engage with electronic module connectors (12), the rack modules (21) being positioned side by side and fastened to one another such that the rack (4) is able to be manipulated as a single unit.

Abstract: The rack (4), which is provided to receive electronic module that can be plugged in, has a modular construction and comprises at least two rack modules (21), each rack module (21) defining a cell (8) for receiving at least one electronic module (6), each rack module (21) having at least a side wall (22), a lower wall (24) and a rear wall (26) defining the cell (8), the lower wall (24) being configured to ensure a distribution of air inside the cell (8), the rear wall (26) being provided with connector openings (32) for fastening rack connectors (20) provided to engage with electronic module connectors (12), the rack modules (21) being positioned side by side and fastened to one another such that the rack (4) is able to be manipulated as a single unit.

Abstract: The electronic computer according to the invention comprises: a storage case comprising a housing including an air inlet and an air outlet for the circulation of a flow of cooling air through the housing, an electronic motherboard comprising a first surface and a second surface, the second surface being provided with connectors for receiving electronic daughterboards, and an air channeling system configured so as to channel the air hitting the first surface of the electronic motherboard to bring it to the side of the second surface of the electronic motherboard. According to one aspect of the invention, the air channeling system is configured to spray the electronic daughterboards, so as to cool said electronic daughterboards through convection of the air.