Patents by Inventor Frands Nielsen

Frands Nielsen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Abrasives for copper CMP and methods for making
    Patent number: 7455791
    Abstract: An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.
    Type: Grant
    Filed: December 14, 2004
    Date of Patent: November 25, 2008
    Assignee: J.M. Huber Corporation
    Inventors: Duen-Wu Hua, Frands Nielsen
  • Abrasives for copper CMP and methods for making
    Patent number: 6913634
    Abstract: An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.
    Type: Grant
    Filed: February 14, 2003
    Date of Patent: July 5, 2005
    Assignee: J. M. Huber Corporation
    Inventors: Duen-Wu Hua, Frands Nielsen
  • Abrasives for copper CMP and methods for making
    Publication number: 20050092962
    Abstract: An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.
    Type: Application
    Filed: December 14, 2004
    Publication date: May 5, 2005
    Inventors: Duen-Wu Hua, Frands Nielsen
  • Abrasives for copper CMP and methods for making
    Publication number: 20040162006
    Abstract: An aqueous chemical mechanical polishing slurry is provided that comprises precipitated amorphous silica abrasive particles treated with acidic aluminum. Also provided is a method of polishing an electronic component substrate comprising the steps of: a) obtaining an electronic component substrate, the electronic component substrate having an insulating film deposited over it, an interconnection pattern formed in the insulating film, and interconnection material deposited on the insulated film and in the interconnection pattern; and b) polishing the interconnection material until a surface of said insulating film is exposed by using an aqueous chemical mechanical polishing slurry comprising: precipitated amorphous silica abrasive particles treated with acidic aluminum.
    Type: Application
    Filed: February 14, 2003
    Publication date: August 19, 2004
    Inventors: Duen-Wu Hua, Frands Nielsen