Abstract: A broadband service, such as Digital Subscriber Line (DSL) service, may be tested by a technician installing or performing maintenance on the broadband service. The technician may use the subscriber's computer as a test set, in which the technician may login to a testing service that may test the line using test equipment located externally to the subscriber premise. A test application may receive, from a computing device located at the subscriber premise, a request to test the broadband service at the subscriber premise as part of installation of the broadband service. The test application may initiate a test of the broadband service using test equipment located externally to the subscriber premise. The test may include tests relating at least to the physical layer of the broadband network connection. Results of the test may be transmitted to the subscriber premise.

Abstract: A broadband service, such as Digital Subscriber Line (DSL) service, may be tested by a technician installing or performing maintenance on the broadband service. The technician may use the subscriber's computer as a test set, in which the technician may login to a testing service that may test the line using test equipment located externally to the subscriber premise. A test application may receive, from a computing device located at the subscriber premise, a request to test the broadband service at the subscriber premise as part of installation of the broadband service. The test application may initiate a test of the broadband service using test equipment located externally to the subscriber premise. The test may include tests relating at least to the physical layer of the broadband network connection. Results of the test may be transmitted to the subscriber premise.

Abstract: This invention describes a radiation-emitting semiconductor component with the a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face (2), and whose first principal face (2) adjoins the multilayered structure (4). At least one recess (8) is made in the window (1), which preferably has the form of an indentation of the second principal face or as an edge excavation. At least one lateral surface of the window (1) or of the recess (8) is provided at least partially with a contact surface (11). Alternatively or cumulatively, at least one contact surface of the component has a plurality of openings (14).

Abstract: Radiation-emitting semiconductor device, method for fabricating same and radiation-emitting optical device. A radiation-emitting semiconductor device with a multilayer structure (100) comprising a radiation-emitting active layer (10), with electrical contacts (30, 40) for impressing a current in the multilayer structure (100) and with a radiotransparent window layer (20). The window layer is arranged exclusively on the side of the multilayer structure (100) facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion (20a) which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence.

Abstract: A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.

Abstract: A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.

Abstract: Radiation-emitting semiconductor device, method for fabricating same and radiation-emitting optical device. A radiation-emitting semiconductor device with a multilayer structure (100) comprising a radiation-emitting active layer (10), with electrical contacts (30, 40) for impressing a current in the multilayer structure (100) and with a radiotransparent window layer (20). The window layer is arranged exclusively on the side of the multilayer structure (100) facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion (20a) which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence.

Abstract: A radiation-emitting semiconductor device with a multilayer structure comprising a radiation-emitting active layer, with electrical contacts for impressing a current in the multilayer structure and with a radiotransparent window layer. The window layer is arranged exclusively on the side of the multilayer structure facing away from a main direction of radiation of the semiconductor device and has at least one side wall that includes a first side wall portion which extends obliquely, concavely or in a stepwise manner toward a central axis of the semiconductor device lying perpendicular to the multilayer sequence. In its subsequent extension toward the back side, viewed from the multilayer structure, the side wall changes over into a second side wall portion that extends perpendicularly to the multilayer structure, that is, parallel to the central axis, and the portion of the window layer encompassing the second side wall portion forms a mounting pedestal for the semiconductor device.

Abstract: Radiation-emitting semiconductor device, method for fabricating same and radiation-emitting optical device

Abstract: A connection bolt arrangement typically used for connecting two structural members to each other, for example in aircraft construction, includes a conically tapered connection bolt that is force-locked or frictionally engaged in an expansion sleeve so as to cause a radial outward expansion of the sleeve and thereby tightly hold the structural components. An apparatus for releasing such a connection bolt arrangement includes two levers that are pivotably connected to each other, a stamping actuator arranged between respective first ends of the two levers, a pulling extraction device mounted at the second end of the first lever, and a pushing block mounted at the second end of the second lever. The actuating force applied by the actuator is transmitted through the levers and applied to the connection bolt and to the expansion sleeve in opposite directions so as to tend to push the bolt out of the sleeve.