Patents by Inventor Frank Armstrong

Frank Armstrong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230102345
    Abstract: An electronic device includes a substrate having a surface, functional metallic traces on a first portion of the surface that are electrically connected to carry current in the electronic device and have a first density, and dummy metallic traces on a second portion of the surface that are electrically isolated from the functional metallic traces and have a second density that is within at least 50% of the first density.
    Type: Application
    Filed: June 7, 2022
    Publication date: March 30, 2023
    Inventor: Frank ARMSTRONG
  • Patent number: 10798322
    Abstract: A pixel array within an integrated-circuit image sensor is exposed to light representative of a scene during a first frame interval and then oversampled a first number of times within the first frame interval to generate a corresponding first number of frames of image data from which a first output image may be constructed. One or more of the first number of frames of image data are evaluated to determine whether a range of luminances in the scene warrants adjustment of an oversampling factor from the first number to a second number, if so, the oversampling factor is adjusted such that the pixel array is oversampled the second number of times within a second frame interval to generate a corresponding second number of frames of image data from which a second output image may be constructed.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: October 6, 2020
    Assignee: Rambus Inc.
    Inventors: Craig M. Smith, Frank Armstrong, Jay Endsley, Thomas Vogelsang, James E. Harris, John Ladd, Michael Guidash
  • Publication number: 20190082125
    Abstract: A pixel array within an integrated-circuit image sensor is exposed to light representative of a scene during a first frame interval and then oversampled a first number of times within the first frame interval to generate a corresponding first number of frames of image data from which a first output image may be constructed. One or more of the first number of frames of image data are evaluated to determine whether a range of luminances in the scene warrants adjustment of an oversampling factor from the first number to a second number, if so, the oversampling factor is adjusted such that the pixel array is oversampled the second number of times within a second frame interval to generate a corresponding second number of frames of image data from which a second output image may be constructed.
    Type: Application
    Filed: September 25, 2018
    Publication date: March 14, 2019
    Inventors: Craig M. Smith, Frank Armstrong, Jay Endsley, Thomas Vogelsang, James E. Harris, John Ladd, Michael Guidash
  • Patent number: 10104318
    Abstract: A pixel array within an integrated-circuit image sensor is exposed to light representative of a scene during a first frame interval and then oversampled a first number of times within the first frame interval to generate a corresponding first number of frames of image data from which a first output image may be constructed. One or more of the first number of frames of image data are evaluated to determine whether a range of luminances in the scene warrants adjustment of an oversampling factor from the first number to a second number, if so, the oversampling factor is adjusted such that the pixel array is oversampled the second number of times within a second frame interval to generate a corresponding second number of frames of image data from which a second output image may be constructed.
    Type: Grant
    Filed: December 3, 2014
    Date of Patent: October 16, 2018
    Assignee: Rambus Inc.
    Inventors: Craig M. Smith, Frank Armstrong, Jay Endsley, Thomas Vogelsang, James E. Harris, John Ladd, Michael Guidash
  • Publication number: 20160323524
    Abstract: A pixel array within an integrated-circuit image sensor is exposed to light representative of a scene during a first frame interval and then oversampled a first number of times within the first frame interval to generate a corresponding first number of frames of image data from which a first output image may be constructed. One or more of the first number of frames of image data are evaluated to determine whether a range of luminances in the scene warrants adjustment of an oversampling factor from the first number to a second number, if so, the oversampling factor is adjusted such that the pixel array is oversampled the second number of times within a second frame interval to generate a corresponding second number of frames of image data from which a second output image may be constructed.
    Type: Application
    Filed: December 3, 2014
    Publication date: November 3, 2016
    Inventors: Craig M. Smith, Frank Armstrong, Jay Endsley, Thomas Vogelsang, James E. Harris, John Ladd, Michael Guidash
  • Patent number: 9402042
    Abstract: A method for operating a focal plane array in a Time Delay Integration (TDI) mode, the method including: shifting a number of rows during TDI integration, wherein the number of rows shifted is less than a total number of rows of the focal plane array; and reading out a number of rows equal to the total number of rows of the focal plane array minus the number of rows shifted, leaving behind the partially-integrated rows.
    Type: Grant
    Filed: October 11, 2013
    Date of Patent: July 26, 2016
    Assignee: Thorlabs, Inc.
    Inventors: Martin Parker, Jason Mills, Ash Prabala, Frank Armstrong, Jeffrey Erickson, Gregory Havenga, Charles Taylor, William Ratdke
  • Publication number: 20140122347
    Abstract: A system for life-cycle tracking of recycle commodities providing a multitude of users with real-time tracking and accounting data related to the progress of recycle commodities from bundling of the recycle commodities at a waste generator, through consolidation of the recycle commodities, and then finally the selling of the recycle commodities from the waste generator directly to a recycler.
    Type: Application
    Filed: November 1, 2012
    Publication date: May 1, 2014
    Applicant: BNSF LOGISTICS
    Inventors: Andrew Moran, Frank Armstrong, Lorne Campbell
  • Publication number: 20140104468
    Abstract: A method for operating a focal plane array in a Time Delay Integration (TDI) mode, the method including: shifting a number of rows during TDI integration, wherein the number of rows shifted is less than a total number of rows of the focal plane array; and reading out a number of rows equal to the total number of rows of the focal plane array minus the number of rows shifted, leaving behind the partially-integrated rows.
    Type: Application
    Filed: October 11, 2013
    Publication date: April 17, 2014
    Applicant: Thorlabs, Inc.
    Inventors: Martin Parker, Jason Mills, Ash Prabala, Frank Armstrong, Jeffrey Erickson, Gregory Havenga, Charles Taylor, William Ratdke
  • Publication number: 20130332861
    Abstract: A data collaboration system includes first and second users providing first and second quantities of content data, respectively. The first and second users provide the first and second quantity of content data, respectively, to a collaboration environment. A user collaboration module within the collaboration environment has a plurality of data tools usable by the first and second users who, in collaboration, use the plurality of data tools to create a third quantity of content data from the first and second quantities of content data. A data processing platform is in communication with the collaboration environment, wherein the third quantity of content data is uploaded to the data processing platform and integrated with existing content data, wherein additional users access the data processing platform through additional collaboration environments and control at least part of the integration of the third quantity of content data within the data processing platform.
    Type: Application
    Filed: December 22, 2011
    Publication date: December 12, 2013
    Inventors: Frank Armstrong D'Agnese, Julia Armstrong D'Agnese
  • Patent number: 8432461
    Abstract: The present invention relates to a digital camera that includes a wireless modem for transferring images via a wireless network. Before taking photos, the user can select various configuration settings, one of which uploads tagged images to a photo service provider or other website. If a network connection is not available when images are captured, the camera automatically wakes up later to check for network availability. If a suitable network connection is available, the camera operates in a reduced power state to upload the images from the camera. Data indicating whether or not each image has been uploaded and/or transferred via the wireless network is stored in the camera, and icons are displayed along with the images, to indicate to the user whether or not an image has been transferred to their computer or uploaded to their website.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: April 30, 2013
    Assignee: Apple Inc.
    Inventors: Keith S. Karn, Thomas A. Napoli, Frank Armstrong
  • Patent number: 7898724
    Abstract: A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.
    Type: Grant
    Filed: November 5, 2008
    Date of Patent: March 1, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Jane Qian Liu, Frank Armstrong, Edward Carl Fisher, Scott Patrick Overmann, Leatrice Lea Gallman Adams
  • Publication number: 20100157067
    Abstract: The present invention relates to a digital camera that includes a wireless modem for transferring images via a wireless network. Before taking photos, the user can select various configuration settings, one of which uploads tagged images to a photo service provider or other website. If a network connection is not available when images are captured, the camera automatically wakes up later to check for network availability. If a suitable network connection is available, the camera operates in a reduced power state to upload the images from the camera. Data indicating whether or not each image has been uploaded and/or transferred via the wireless network is stored in the camera, and icons are displayed along with the images, to indicate to the user whether or not an image has been transferred to their computer or uploaded to their website.
    Type: Application
    Filed: September 28, 2009
    Publication date: June 24, 2010
    Inventors: Keith S. Karn, Thomas A. Napoli, Frank Armstrong
  • Publication number: 20100110527
    Abstract: A packaged electronic device includes a substrate with an upper surface interrupted by a well formed in the substrate. The well has a substrate bottom surface and a substrate sidewall. An electronic device is located in the well over the substrate bottom surface and has a device top surface and a device sidewall. A trench is bounded by the substrate bottom surface, the substrate sidewall and the device sidewall. An encapsulant at least partially fills the trench and contacts the substrate sidewall and the device sidewall. The encapsulant has a first elevation on the substrate sidewall with respect to the substrate bottom surface and a second elevation on the substrate device sidewall with respect to the substrate bottom surface that is at least about 35% greater than the first elevation.
    Type: Application
    Filed: November 5, 2008
    Publication date: May 6, 2010
    Applicant: Texas Instruments Incorporated
    Inventors: Jane Qian Liu, Frank Armstrong, Edward Carl Fisher, Scott Patrick Overmann, Leatrice Lea Gallman Adams
  • Publication number: 20090126087
    Abstract: The present invention relates to protective apparatus suitable to provide users of electrical implantable medical devices protection from impacts. More specifically, the present invention relates to protective apparatus suitable to provide users of pacemakers, both internal and external, protection from impacts due to applied or external forces. The apparatus comprises a rigid or semi-rigid outer shell or layer, an impact absorbing inner pad or layer and, optionally, a recess for containing an external electronic device. The outer shell or layer provides impact and deformation resistance while distributing impact forces. The outer shell or layer is formed using a sufficiently thermally pliable material capable of molding to the body part containing, or in contact with, the electronic device. Electrical implantable medical devices are further protected by the inner pad or layer comprising a high density closed cell foam.
    Type: Application
    Filed: October 29, 2008
    Publication date: May 21, 2009
    Inventors: Frank Armstrong, Sharon M. Spinnler
  • Publication number: 20050185252
    Abstract: An improved window frame and window piece for a micromirror assembly is disclosed herein. The window frame includes a stress-relieving contour positioned in the middle of the frame that can absorb the mechanical stresses applied to the window frame from the ceramic base and from the window piece. The window frame may be comprised of a single piece of sheet metal that has been stamped to include a stress-relieving contour. The stress-relieving contour may be comprised of a variety of shapes, including a ā€œUā€ shape, an inverted ā€œUā€ shape, a curved step shape, or other combinations thereof.
    Type: Application
    Filed: April 28, 2005
    Publication date: August 25, 2005
    Inventors: Bradley Haskett, John O'Connor, Steven Smith, Mark Miller, Ivan Kmecko, Jwei Liu, Edward Fisher, Frank Armstrong, Daniel Estabrook, Jeffrey Faris
  • Patent number: 6580457
    Abstract: A method of reading out a CCD interline image sensor having M lines×N columns of photosites, N vertical shift registers corresponding to the N columns of photosites, and a horizontal shift register, comprising the steps of: exposing the sensor to a first exposure such that all the M lines of photosites are exposed; transferring a subset of the M lines of photosites from the exposed lines of photosites to the N vertical shift registers; serially shifting each line of data from the N vertical shift registers to the horizontal shift register and reading out the horizontal shift register until all of the lines of data have been read out except for a second subset of the M lines; exposing the sensor to a second exposure such that the second subset of the M lines of photosites have remained in the sensor; and transferring the data from the exposed lines of photosites of the second exposure to the N vertical shift registers, except for the second subset of the M lines, thereby increasing the frame rate of the
    Type: Grant
    Filed: November 3, 1998
    Date of Patent: June 17, 2003
    Assignee: Eastman Kodak Company
    Inventors: Frank Armstrong, Mark Grabosky
  • Patent number: D673275
    Type: Grant
    Filed: December 13, 2011
    Date of Patent: December 25, 2012
    Inventors: Frank Armstrong, Sharon M. Spinnler