Patents by Inventor Frank Bernhardt
Frank Bernhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10870372Abstract: A vehicle seat, in particular a motor vehicle seat, having a first structural part (4), a second structural part (6) and at least one fitting (10) that can be locked and unlocked, the fitting (10) having a first fitting part (11), which is at least indirectly connected to the first structural part (4), and a second fitting part (12), which is at least indirectly connected to the second structural part (6). When the fitting (10) is unlocked, an angular position of the second structural part (6) relative to the first structural part (4) can be varied about an axis (A). In at least one angular position of the second structural part (6) relative to the first structural part (4), a spring element (100, 100.1, 200) braces the first fitting part (11) and the second fitting part (12) with respect to each other in the radial direction.Type: GrantFiled: September 28, 2017Date of Patent: December 22, 2020Assignee: Adient Luxembourg Holding S.á r.l.Inventors: Michael Koenig, Martin Reischmann, Thomas Rau, Frank Bernhardt, Dirk Dubois
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Publication number: 20190299820Abstract: A vehicle seat, in particular a motor vehicle seat, having a first structural part (4), a second structural part (6) and at least one fitting (10) that can be locked and unlocked, the fitting (10) having a first fitting part (11), which is at least indirectly connected to the first structural part (4), and a second fitting part (12), which is at least indirectly connected to the second structural part (6). When the fitting (10) is unlocked, an angular position of the second structural part (6) relative to the first structural part (4) can be varied about an axis (A). In at least one angular position of the second structural part (6) relative to the first structural part (4), a spring element (100, 100.1, 200) braces the first fitting part (11) and the second fitting part (12) with respect to each other in the radial direction.Type: ApplicationFiled: September 28, 2017Publication date: October 3, 2019Applicant: Adient Luxembourg Holding S.à r.l.Inventors: Michael KOENIG, Martin REISCHMANN, Thomas RAU, Frank BERNHARDT, Dirk DUBOIS
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Patent number: 9821308Abstract: Disclosed is a device for the directed capillary transport of liquids, comprising at least two capillaries (8, 9, 33, 54, 55), the at least two capillaries (8, 9, 33, 54, 55) being designed such that the liquid can be transported in at least some regions in a passive, directed and capillary manner, characterised in that at least two of the capillaries (8, 9, 33, 54, 55) are interconnected in the direction of transport of the liquid via at least one capillary passage conduit (20, 23, 28, 29, 34, 40, 41, 59, 63). The invention is intended for use in the separation of components from a fluidic substance and/or in oil/water separation. A production method is characterised in that at least one part of the capillary structure is generated by means of laser irradiation, by means of a moulding tool, in particular a sintering mould, by means of a milling process, in particular by means of a micro-milling process, or by means of EDM.Type: GrantFiled: June 28, 2013Date of Patent: November 21, 2017Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.v.Inventors: Philipp Comanns, Werner Baumgartner, Frank Bernhardt, Kai Winands, Kristian Arntz
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Publication number: 20170033433Abstract: The present invention concerns an antenna (20) with a layered structure, in particular a single or double layer antenna (20) integrated into vehicle-windshield having a conformal foil structure comprising a monopole arm (21) and ground plane arms (22, 23), wherein the antenna (20) has a transparency of 70%-90%.Type: ApplicationFiled: April 14, 2014Publication date: February 2, 2017Applicants: Shanghai Amphenol Airwave Communication Electronics Co., Ltd., Amphenol Finland OYInventors: Andreas WINKELMANN, Christian FUHR, Frank BERNHARDT, Mario FALIERO, Björn CEDERBERG, Xinshan ZHANG, Zlatoljub MILOSAVLJEVIC, Norbert LOTTERER
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Method for producing a dielectric interlayer and storage capacitor with such a dielectric interlayer
Patent number: 7880212Abstract: A dielectric interlayer, especially for a storage capacitor, is formed from a layer sequence subjected to a temperature process, wherein the layer sequence has at least a first metal oxide layer and a second metal oxide layer formed by completely oxidizing a metal nitride layer to higher valency.Type: GrantFiled: August 25, 2008Date of Patent: February 1, 2011Assignee: Qimonda AGInventors: Bernd Hintze, Henry Bernhardt, Frank Bernhardt -
METHOD FOR PRODUCING A DIELECTRIC INTERLAYER AND STORAGE CAPACITOR WITH SUCH A DIELECTRIC INTERLAYER
Publication number: 20080316675Abstract: A dielectric interlayer, especially for a storage capacitor, is formed from a layer sequence subjected to a temperature process, wherein the layer sequence has at least a first metal oxide layer and a second metal oxide layer formed by completely oxidizing a metal nitride layer to higher valency.Type: ApplicationFiled: August 25, 2008Publication date: December 25, 2008Inventors: Bernd Hintze, Henry Bernhardt, Frank Bernhardt -
Method for producing a dielectric interlayer and storage capacitor with such a dielectric interlayer
Patent number: 7416952Abstract: A dielectric interlayer, especially for a storage capacitor, is formed from a layer sequence subjected to a temperature process, wherein the layer sequence has at least a first metal oxide layer and a second metal oxide layer formed by completely oxidizing a metal nitride layer to higher valency.Type: GrantFiled: May 23, 2006Date of Patent: August 26, 2008Assignee: Infineon Technologies AGInventors: Bernd Hintze, Henry Bernhardt, Frank Bernhardt -
Method for producing a dielectric interlayer and storage capacitor with such a dielectric interlayer
Publication number: 20070272965Abstract: A dielectric interlayer, especially for a storage capacitor, is formed from a layer sequence subjected to a temperature process, wherein the layer sequence has at least a first metal oxide layer and a second metal oxide layer formed by completely oxidizing a metal nitride layer to higher valency.Type: ApplicationFiled: May 23, 2006Publication date: November 29, 2007Applicant: Infineon Technologies AGInventors: Bernd Hintze, Henry Bernhardt, Frank Bernhardt -
Patent number: 7028565Abstract: The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).Type: GrantFiled: February 2, 2004Date of Patent: April 18, 2006Assignee: Leica Microsystems Jena GmbHInventors: Andreas Birkner, Frank Bernhardt, Knut Hiltawski
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Patent number: 6845174Abstract: An arrangement for the identification of a substrate (S) having at least one identification marking (I), comprising a turntable (2) for rotating a substrate (S) placed thereon; an illumination source (4) and a receiving device (5) for evaluating the intensity of the light emerging from the illumination source (4), the edge zone of the substrate (S) placed on the turntable (2), upon rotation thereof, influencing the light intensity striking the receiving device (5); a device (6) for reading the identification marking (I), having a sensing region (E); and a calculation device that calculates a manipulated variable for a correction rotation angle about the rotation axis (A) for alignment of the identification marking (I) with respect to the sensing region (E), and a manipulated variable for a correction motion for changing the position of the sensing region (E) with respect to the rotation axis (A) or with respect to the actual position of the identification marking (I), and outputs them to a positioning deviType: GrantFiled: January 18, 2002Date of Patent: January 18, 2005Assignee: Leica Microsystems Jena GmbHInventors: Dominik Grau, Andreas Birkner, Knut Hiltawski, Frank Bernhardt
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Patent number: 6789436Abstract: The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).Type: GrantFiled: March 6, 2003Date of Patent: September 14, 2004Assignee: Leica Microsystems Jena GmbHInventors: Andreas Birkner, Frank Bernhardt, Knut Hiltawski
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Publication number: 20040149055Abstract: The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).Type: ApplicationFiled: February 2, 2004Publication date: August 5, 2004Applicant: LEICA MICROSYSTEMS JENA GmbHInventors: Andreas Birkner, Frank Bernhardt, Knut Hiltawski
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Publication number: 20030140716Abstract: The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).Type: ApplicationFiled: March 6, 2003Publication date: July 31, 2003Applicant: LEICA MICROSYSTEMS JENA GmbHInventors: Andreas Birkner, Frank Bernhardt, Knut Hiltawski
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Patent number: 6553850Abstract: The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c ) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).Type: GrantFiled: January 24, 2002Date of Patent: April 29, 2003Assignee: Leica Microsystems Jena GmbHInventors: Andreas Birkner, Frank Bernhardt, Knut Hiltawski
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Publication number: 20020187035Abstract: The invention concerns an arrangement for wafer inspection, having a device (3) for transporting the wafers (S) from a transfer station (5) to at least one inspection station (7, 9). For transportation of the wafers (S), the device (3) comprises a feeder (4), rotatable about a rotation axis (Z), having at least one wafer support (14) whose position is pivotable, with the rotation of the feeder (4), between the transfer station (5) and inspection station (7, 9); and a drive device (18) that is coupled to the feeder (4) and with the activation of which the feeder (4) is caused to rotate through a predefined reference rotation angle.Type: ApplicationFiled: April 29, 2002Publication date: December 12, 2002Applicant: LEICA MICROSYSTEMS JENA GmbHInventors: Kersten Schaefer, Karsten Urban, Frank Bernhardt, Joachim Wienecke
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Publication number: 20020095999Abstract: The invention relates to an arrangement for transporting and inspecting semiconductor substrates (6), having at least three workstations (8, 10, 12), a changer (14), which has at least three arms (14a, 14b, 14c) which are designed to load the individual workstations (8, 10, 12) with semiconductor substrates (6). A measuring device (15) is assigned to the second workstation (10), determines the deviation of the current position of the semiconductor substrate (6) and makes it available to the arrangement (3) for the further inspection of the semiconductor substrate (6). In addition, the changer (14) is not equipped with means for exact positioning of the semiconductor substrates (6) in the workstations (8, 10, 12).Type: ApplicationFiled: January 24, 2002Publication date: July 25, 2002Applicant: LEICA MICROSYSTEMS JENA GmbHInventors: Andreas Birkner, Frank Bernhardt, Knut Hiltawski
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Publication number: 20020097905Abstract: An arrangement for the identification of a substrate (S) having at least one identification marking (I), comprisingType: ApplicationFiled: January 18, 2002Publication date: July 25, 2002Applicant: Leica Microsystems Jena GmbHInventors: Dominik Grau, Andreas Birkner, Knut Hiltawski, Frank Bernhardt