Patents by Inventor Frank Bi
Frank Bi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220263484Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include temperature compensation layers (TCL) that improve the device TCF. These layers can be thin layers of oxide type materials and can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, between two or more piezoelectric layers, and any combination thereof. In an example, the TCLs can be configured from thick passivation layers overlying the top electrode and/or underlying the bottom electrode.Type: ApplicationFiled: May 4, 2022Publication date: August 18, 2022Inventors: Dae Ho KIM, Frank BI, Mary WINTERS, Ramakrishna VETURY, Abhay KOCHHAR
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Patent number: 11356071Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include temperature compensation layers (TCL) that improve the device TCF. These layers can be thin layers of oxide type materials and can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, between two or more piezoelectric layers, and any combination thereof. In an example, the TCLs can be configured from thick passivation layers overlying the top electrode and/or underlying the bottom electrode.Type: GrantFiled: June 4, 2020Date of Patent: June 7, 2022Assignee: Akoustis, Inc.Inventors: Dae Ho Kim, Frank Bi, Mary Winters, Ramakrishna Vetury, Abhay Kochhar
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Publication number: 20200304087Abstract: A method and structure for a transfer process for an acoustic resonator device. In an example, a bulk acoustic wave resonator (BAWR) with an air reflection cavity is formed. A piezoelectric thin film is grown on a crystalline substrate. Patterned electrodes are deposited on the surface of the piezoelectric film. An etched sacrificial layer is deposited over the electrodes and a planarized support layer is deposited over the sacrificial layer. The device can include temperature compensation layers (TCL) that improve the device TCF. These layers can be thin layers of oxide type materials and can be configured between the top electrode and the piezoelectric layer, between the bottom electrode and the piezoelectric layer, between two or more piezoelectric layers, and any combination thereof. In an example, the TCLs can be configured from thick passivation layers overlying the top electrode and/or underlying the bottom electrode.Type: ApplicationFiled: June 4, 2020Publication date: September 24, 2020Inventors: Dae Ho KIM, Frank BI, Mary WINTERS, Ramakrishna VETURY, Abhay KOCHHAR
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Patent number: 9876483Abstract: An microelectronic device includes a substrate, a piezoelectric component formed over the substrate, at least one trench formed in the substrate. The piezoelectric component has a corresponding resonance frequency. The at least one trench is configured to reduce mechanical stress on the piezoelectric component, in response to force applied to the substrate, for stabilizing the resonance frequency.Type: GrantFiled: March 28, 2014Date of Patent: January 23, 2018Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Steven M. Ortiz, Suresh Sridaran, Frank Bi, Martha K. Small
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Publication number: 20170179924Abstract: An acoustic resonator structure comprises: a substrate having a cavity, which has a plurality of sides; a first electrode disposed over the cavity; a piezoelectric layer disposed over a portion of the first electrode and extending over at least one of the sides; and a second electrode disposed over the piezoelectric layer, an overlap of the first electrode, the piezoelectric layer and the second electrode forming an active area of the FBAR. The active area of the FBAR is completely suspended over the cavity.Type: ApplicationFiled: March 3, 2017Publication date: June 22, 2017Inventors: Frank Bi, Martha K. Small, Suresh Sridaran, Richard C. Ruby
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Patent number: 9608592Abstract: An acoustic resonator structure comprises: a substrate having a cavity, which has a plurality of sides; a first electrode disposed over the cavity; a piezoelectric layer disposed over a portion of the first electrode and extending over at least one of the sides; and a second electrode disposed over the piezoelectric layer, an overlap of the first electrode, the piezoelectric layer and the second electrode forming an active area of the FBAR. The active area of the FBAR is completely suspended over the cavity.Type: GrantFiled: January 21, 2014Date of Patent: March 28, 2017Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Frank Bi, Martha K. Small, Suresh Sridaran, Richard C. Ruby
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Patent number: 9450167Abstract: An acoustic resonator comprises: an acoustic resonator device comprises: a composite first electrode disposed over a substrate, the composite first electrode comprising: a first electrically conductive layer provided over the substrate; a first interlayer disposed on the first electrical conductive layer; a buried temperature compensation layer disposed over the first interlayer; a second interlayer disposed over the temperature compensation layer; a second electrically conductive layer disposed over the second interlayer, a piezoelectric layer disposed over the composite first electrode; and a second electrode disposed over the piezoelectric layer.Type: GrantFiled: September 27, 2013Date of Patent: September 20, 2016Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Qiang Zou, Donald Lee, Martha K. Small, Frank Bi, Tina L. Lamers, Richard C. Ruby
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Publication number: 20150280688Abstract: An microelectronic device includes a substrate, a piezoelectric component formed over the substrate, at least one trench formed in the substrate. The piezoelectric component has a corresponding resonance frequency. The at least one trench is configured to reduce mechanical stress on the piezoelectric component, in response to force applied to the substrate, for stabilizing the resonance frequency.Type: ApplicationFiled: March 28, 2014Publication date: October 1, 2015Applicant: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.Inventors: Steven Ortiz, Suresh Sridaran, Frank Bi, Martha K. Small
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Publication number: 20150207489Abstract: An acoustic resonator structure comprises: a substrate having a cavity, which has a plurality of sides; a first electrode disposed over the cavity; a piezoelectric layer disposed over a portion of the first electrode and extending over at least one of the sides; and a second electrode disposed over the piezoelectric layer, an overlap of the first electrode, the piezoelectric layer and the second electrode forming an active area of the FBAR. The active area of the FBAR is completely suspended over the cavity.Type: ApplicationFiled: January 21, 2014Publication date: July 23, 2015Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Frank Bi, Martha K. Small, Suresh Sridaran, Richard C. Ruby
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Publication number: 20140292150Abstract: An acoustic resonator comprises: an acoustic resonator device comprises: a composite first electrode disposed over a substrate, the composite first electrode comprising: a first electrically conductive layer provided over the substrate; a first interlayer disposed on the first electrical conductive layer; a buried temperature compensation layer disposed over the first interlayer; a second interlayer disposed over the temperature compensation layer; a second electrically conductive layer disposed over the second interlayer, a piezoelectric layer disposed over the composite first electrode; and a second electrode disposed over the piezoelectric layer.Type: ApplicationFiled: September 27, 2013Publication date: October 2, 2014Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.Inventors: Qiang Zou, Donald Lee, Martha K. Small, Frank Bi, Tina L. Lamers, Richard C. Ruby
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Patent number: 7795781Abstract: According to an exemplary embodiment, a bulk acoustic wave (BAW) resonator includes a piezoelectric layer having a disrupted texture region, where the disrupted texture region is situated in a controlled thickness region of the BAW resonator. The BAW resonator further includes lower and upper electrodes situated on opposite surfaces of the piezoelectric layer. The controlled thickness region has controlled electromechanical coupling and includes a segment of material situated over the upper electrode. The segment of material can be a metal or a dielectric material. The disrupted texture region can be situated at an edge of the BAW resonator and can extend along a perimeter of the BAW resonator.Type: GrantFiled: April 24, 2008Date of Patent: September 14, 2010Assignee: Avago Technologies Wireless IP (Singapore) Pte. Ltd.Inventors: Bradley P. Barber, Frank Bi, Craig E. Carpenter
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Publication number: 20090267457Abstract: According to an exemplary embodiment, a bulk acoustic wave (BAW) resonator includes a piezoelectric layer having a disrupted texture region, where the disrupted texture region is situated in a controlled thickness region of the BAW resonator. The BAW resonator further includes lower and upper electrodes situated on opposite surfaces of the piezoelectric layer. The controlled thickness region has controlled electromechanical coupling and includes a segment of material situated over the upper electrode. The segment of material can be a metal or a dielectric material. The disrupted texture region can be situated at an edge of the BAW resonator and can extend along a perimeter of the BAW resonator.Type: ApplicationFiled: April 24, 2008Publication date: October 29, 2009Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Bradley P. Barber, Frank Bi, Craig E. Carpenter
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Publication number: 20090267453Abstract: According to an exemplary embodiment, a bulk acoustic wave (BAW) resonator includes a piezoelectric layer situated between upper and lower electrodes, where each of the upper and lower electrodes are a high density metal. The BAW resonator further includes a controlled thickness region including a low density metal segment, where the low density metal segment is situated adjacent to the piezoelectric layer, and where the controlled thickness region has controlled electromechanical coupling. The controlled thickness region can provide reduced electromechanical coupling into lateral modes. The low density metal segment can extend along the perimeter of the BAW resonator.Type: ApplicationFiled: April 24, 2008Publication date: October 29, 2009Applicant: SKYWORKS SOLUTIONS, INC.Inventors: Bradley P. Barber, Frank Bi, Craig E. Carpenter
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Patent number: 7602102Abstract: According to an exemplary embodiment, a bulk acoustic wave (BAW) resonator includes a piezoelectric layer situated between upper and lower electrodes, where each of the upper and lower electrodes are a high density metal. The BAW resonator further includes a controlled thickness region including a low density metal segment, where the low density metal segment is situated adjacent to the piezoelectric layer, and where the controlled thickness region has controlled electromechanical coupling. The controlled thickness region can provide reduced electromechanical coupling into lateral modes. The low density metal segment can extend along the perimeter of the BAW resonator.Type: GrantFiled: April 24, 2008Date of Patent: October 13, 2009Assignee: Skyworks Solutions, Inc.Inventors: Bradley P. Barber, Frank Bi, Craig E. Carpenter