Abstract: The present invention relates to a method for plasma-treating a surface of a substrate, in particular a dielectric substrate, the method including the following steps: (t) wet-chemical treating the surface of the substrate with treatment solutions of a desmear process, to obtain a wet-chemical treated surface of the substrate, (i) treating a surface of the substrate with a plasma beam under atmospheric pressure, to obtain a plasma-treated surface of the substrate, (ii) activation of the plasma-treated surface of the substrate with an activation composition, to obtain an activated surface of the substrate, (iii) optionally electroless deposition of a coating metal on the activated surface of the substrate, to obtain a plating surface of the substrate, and (iv) optionally electrolytic deposition of an additional coating metal on the plating surface of the substrate obtained after optional step (iii) or on the activated surface of the substrate obtained after step (ii).

Abstract: The present invention relates to a method for providing a multilayer coating on a surface of a substrate comprising the following method steps (i) providing the substrate; (ii) depositing at least one metal oxide compound onto the surface of the substrate; (iii) heat-treating the surface of the substrate such that a metal oxide is formed thereon; (iv) treating the surface of the substrate with a treatment solution comprising at least one nitrogen containing polymeric treatment additive; (v) treating the surface of the substrate with an activation solution; and (vi) treating the surface of the substrate with a metallising solution such that a metal or metal alloy is deposited thereon. The invention further concerns the use of treatment additives as enhancer for the metal deposition.

Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.

Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising: a source of copper ions, a reducing agent or a source of a reducing agent, and a combination of complexing agents comprising i) polyamino disuccinic acid, polyamino monosuccinic acid, or a combination thereof, and ii) one or more of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine, as well as methods for electroless copper plating utilizing the solution and uses of the solution for the plating of various substrates.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising a source of copper ions, a reducing agent or a source of a reducing agent, and a combination comprising i) N,N,N?,N?-Tetrakis (2-hydroxypropyl)ethylenediamine or a salt thereof, and ii) N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid or a salt thereof, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.

Abstract: The invention relates to an electroless aqueous copper plating solution, comprising—a source of copper ions, —a reducing agent or a source of a reducing agent, and—a combination of i) at least one polyamino disuccinic acid, or at least one polyamino monosuccinic acid, or a mixture of at least one polyamino disuccinic acid and at least one polyamino monosuccinic acid, and ii) one or more of a compound which is selected from the group consisting of ethylenediamine tetraacetic acid, N?-(2-Hydroxyethyl)-ethylenediamine-N,N,N?-triacetic acid, and N,N,N?,N?-Tetrakis(2-hydroxypropyl)ethylenediamine, as complexing agents, as well as to a method for electroless copper plating utilizing said solution and the use of the solution for the plating of substrates.

Abstract: The present invention relates to a method for manufacture of fine line circuitry in the manufacture of printed circuit boards, IC substrates and the like. The method utilizes a first conductive layer on the smooth surface of a build-up layer and a second conductive layer selected from electrically conductive polymers, colloidal noble metals and electrically conductive carbon particles on the roughened walls of at least one opening which are formed after depositing the first conductive layer.

Abstract: The present invention discloses a method for electroless plating of a metal or metal alloy onto a metal or a metal alloy structure comprising a metal such as molybdenum or titanium and alloys containing such metals. The method comprises the steps of activation, treatment in an aqueous solution comprising at least one nitrogen-containing compound or a hydroxy carboxylic acid and electroless plating of a metal or metal alloy.