Abstract: The current disclosure includes a method of forming a high strength backing plate for use with a sputtering target comprising solutionizing a first metal material; subjecting the first metal material to equal channel angular extrusion; and aging the first metal material.

Abstract: A method of forming a high strength aluminum alloy. The method comprises subjecting an aluminum material containing at least one of magnesium, manganese, silicon, copper, and zinc at a concentration of at least 0.1% by weight to an equal channel angular extrusion (ECAE) process. The method produces a high strength aluminum alloy having an average grain size from about 0.2 ?m to about 0.8 ?m and a yield strength from about 300 MPa to about 650 MPa.

Abstract: Disclosed herein is a method of forming a high strength aluminum alloy. The method comprises heating an aluminum material to a solutionizing temperature for a solutionizing time such that the magnesium and zinc are dispersed throughout the extruded aluminum material to form a solutionized aluminum material. The method includes quenching the solutionized aluminum material to form a quenched aluminum material. The method also includes aging the quenched aluminum material to form an aluminum alloy, then subjecting the aluminum alloy to an ECAE process to form a high strength aluminum alloy.

Abstract: A method of forming a high strength aluminum alloy. The method comprises heating an aluminum material including scandium to a solutionizing temperature of the aluminum material such that scandium is dispersed throughout the aluminum material to form an aluminum alloy. The method further comprises extruding the aluminum alloy with equal channel angular extrusion to form a high strength aluminum alloy, such that the high strength aluminum alloy has a yield strength greater than about 40 ksi after being at a temperature from about 300° C. to about 400° C. for at least one hour.

Abstract: Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component.

Abstract: The invention includes a target construction having a sputtering region and a flange region laterally outward relative to the sputtering region. The flange region has a front surface disposed on a front face of the construction and a back surface opposing the front surface. An o-ring groove is disposed within the flange region. The o-ring groove has a planar base surface which has a first width and has an orifice disposed along the front surface of the flange. The orifice has a second width as measured parallel relative to the base surface. The second width is greater than the first width. The flange surfaces can additionally be protected from rubbing by a layer of protective material.

Abstract: Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component.