Abstract: Provided are adhesive-backed films and related methods useful in laser cutting a substrate protected by an adhesive-backed film. The adhesive-backed film includes a base layer comprised of a polymer and having opposing first and second major surfaces and an adhesive layer comprising a pressure-sensitive adhesive directly or indirectly coupled to the second major surface. An infrared absorber is present in one or both of the polymer and the pressure-sensitive adhesive, and the adhesive-backed film is sufficiently transparent to enable visual inspection of a surface having the adhesive-backed film disposed thereon.