Abstract: An electronic component socket for leadless or leaded electronic component packages in which the package is clamped within the socket and to which positive electrical contact is made by spring loaded probes. A body of electrically insulative material has an array of parallel passages extending therethrough in a pattern corresponding to the pattern of the electrical contact areas of an associated component to be retained in the socket. A spring probe assembly is included within each passage of the socket body and includes a lower conductive member retained in the passage and having a lead outwardly extending therefrom, and an upper conductive member slidable in the passage and coupled to the lower conductive member by a coil spring. For a leadless package, a contact probe outwardly extends from the upper conductive member and in its unloaded condition projects outwardly from the passage. The probes each includes a pointed tip for mating with the respective contact areas of the leadless package.

Abstract: A carrier socket for leadless chip integrated circuit devices. A flat leadless substrate with a circuit chip thereon is positioned within a housing having spring-loaded contacts mounted therein, each such contact adapted to engage a contact pad on the substrate. A resilient cover engages the housing and holds the substrate against the contacts in a positive manner. The contacts are formed to facilitate electrical connection between the integrated circuit chip and a circuit board. The contacts may be secured to the board by various means such as soldering or planar welding.