Abstract: A pin carrier for locating male contact pins on a printed circuit board (PCB) with a very high degree of accuracy, while placing a very low thermal mass in contact with each male contact pin. The pin carrier has a plurality of chimney structures, each chimney structure configured to retain one male contact pin. Male contact pins are inserted into each chimney such that essentially only that portion of the male contact pin which is to enter the PCB is exposed. The male contact pins are held in the chimney by a frictional retention force just sufficient to maintain the male contact pins securely within the chimneys during shipment and soldering onto a PCB, but not so great as to make removal of the pin carrier difficult after the male contact pins have been soldered to a PCB. In addition to registering the pins while maintaining a low thermal mass, the chimney structure also protects the male contact pin from excessive solder flow due to solder wicking, and from the corrosive effects of solder flux.

Abstract: A pad array socket for use in mechanically and electrically connecting a high density pad array integrated circuit carrier to a printed circuit substrate. The socket comprises a flexible circuit, a molded elastomeric spring member, a frame, and a cover. The frame defines a cavity. The elastomeric spring member is placed at the bottom of the cavity. The flexible circuit is placed directly over the elastomeric spring member. An integrated circuit carrier is placed into the cavity upon the flexible circuit. The cover is then secured over the assembly, thereby applying downward pressure on the integrated circuit carrier. The spring member applies upward pressure to the flexible circuit, thereby causing the electrical contacts of the flexible circuit to come into contact with the electrical contacts of the integrated circuit carrier.

Abstract: A low-profile dual-beam female electrical connector contact for electrically interconnecting components of an electrical system. The contact includes a contact body, cantilevered contact beams, retention flanges, and a solder tail. The contact body is a generally rectangular-shaped structure. Lateral extensions near the middle of the body attach the contact beams to the body. Each contact is generally rectangular and extends from the point of attachment toward the distal end of, and parallel to, the contact body. The retention flanges are located near the distal end of the contact body, and extend from edges thereof. Since the contact beams and the retention flanges are contained within the height of the contact body, the overall height of the contact is reduced.

Abstract: A connector mounting for an integrated circuit chip package having pad-type terminal contacts around its periphery, has a flat synthetic resin housing provided with a recess in its top side for receiving the chip package with its terminal contacts facing downwardly for electrical contact with laterally extending flexible spring contact arm portions of respective contact members mounted in the housing. An electrically conductive metal clamp or cover member is hingedly mounted on the housing to engage and press the chip package downwardly in the housing recess into contact member-engaging position therein. The contact members have rigid contact pin portions firmly anchored in the housing bottom and projecting perpendicularly downward therefrom in row alignment around the housing for plugging into a printed circuit board.

Abstract: The present invention is to a heat sink device designed to conduct heat away from an active device substrate housed in a connector of the type having a hinged cover with spring elements thereon. More particularly the preferred embodiment includes a base member, in intimate contact with the substrate, positioned on the inside of the cover, and a heat exchanger attached to the base and extending above the cover.

Abstract: The present invention relates to a connector of the type for electrically connecting an active device substrate unit for a PCB (printed circuit board). More particularly, the invention includes a dual-contact spring member having a buffer section so that forces exerted on one contact are not transmitted to the other contact.

Abstract: The subject invention relates to a connector for electrically connecting a leadless electronic package to a printed circuit board. More particularly, the connector includes a frame-shape housing containing terminals having a circular contact section which engages the pads on the package. A clamp plate is also disclosed which secures the package and connector to the printed circuit board.

Abstract: The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.

Abstract: The present invention relates to a connector for connecting a semi-conductor chip carrier to a printed circuit board (PCB). More particularly, the invention comprises an insulating housing and a plurality of contact-bearing spring members positioned around the periphery of a central compartment in the housing. The spring member connects the leads on the chip package to traces on the PCB.