Abstract: The present invention relates to spring members positioned in an insulated housing for providing an electrical path from leadless integrated circuit package to a printed circuit board. More particularly the spring members are uniquely constructed in a complex geometric shape to exert forces on contact mating surfaces within closely specified maximum and minimum values and not distort the housing or the printed circuit board.

Abstract: This invention relates to an interconnector for retaining two vertically stacked electronic packages or the like and for electrically connecting them to a printed circuit board. More particularly the interconnector consists of a housing of insulating material and a plurality of contact members spaced around the sides of the housing. Each contact member contains two integral yet independently flexible contacts for engaging the stacked packages. In addition each contact member contains a single pin for printed circuit board interconnection.

Abstract: This invention relates to a device which electrically connects a leadless integrated circuit package to a printed circuit board. More particularly, the device includes a square frame having a plurality of contacts arranged along each side of the housing. The lower end of the contact electrically engages a circuit on the printed circuit board and the upper end electrically engages a circuit on the package. The frame further contains positioning and support clips which permits alignment of the package before engagement is made with the contacts.