Abstract: A means for applying solder paste to surface contact pads on a printed wiring board with a stepped solder stencil is disclosed. The stepped stencil has sections of different thickness. Each stencil section has stencil openings formed therein through which solder is deposited onto the surface contact pads. The individual stencil openings are positioned so paste may be deposited through them on surface contact pads in registration underneath. The stencil sections have different thicknesses so solder can be deposited through all stencil openings of verying size with uniform results. Generally, the smaller sized stencil openings are formed in the thinner stencil sections. When this solder stencil is used it is possible to apply all the solder needed, to bond both standard component leads and fine pitch components in a single pass. Multiple solder applications and multiple vapor phase curing associated with surface mounting techniques, are eliminated.