Patents by Inventor Frank D DERRYBERRY
Frank D DERRYBERRY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958293Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: June 3, 2021Date of Patent: April 16, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 11807005Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: March 28, 2023Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Lam J. Choy
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Patent number: 11712896Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: GrantFiled: April 4, 2022Date of Patent: August 1, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
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Publication number: 20230234355Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-lam J. Choy
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Patent number: 11453222Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.Type: GrantFiled: October 25, 2019Date of Patent: September 27, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: James Michael Gardner, Sirena Lu, Frank D. Derryberry, Michael W. Cumbie
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Publication number: 20220227131Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
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Patent number: 11305537Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-Iam J Choy
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Patent number: 11247470Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: February 15, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20210402788Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a substrate, a surface layer to contact a print liquid in the print liquid reservoir, and a layer stack including a number of metal layers disposed between the substrate and the surface layer. An array of heater elements disposed in one of the metal layers of the layer stack, and an array of thermal sensors disposed in a different one of the metal layers of the layer stack, each thermal sensor corresponding to a different heater element of the array of heater elements, and each thermal sensor to provide indication of a presence or absence of print liquid based on a sensed temperature after being heated by the corresponding heater element.Type: ApplicationFiled: October 25, 2019Publication date: December 30, 2021Applicant: HEWLETT-PARKARD DEVELOPMENT COMPANY, LP.Inventors: James Michael GARDNER, Frank D. DERRYBERRY, Sirena LU
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Publication number: 20210402786Abstract: A liquid level sensor package for a replaceable print liquid reservoir, the package including a number of heater circuits, each heater circuit including a heater element to dissipate heat and a number of control devices, each control device individually controllable to be electrically connected to the heater element, the heater element to dissipate a different amount of heat when electrically connected to different ones of the control devices.Type: ApplicationFiled: October 25, 2019Publication date: December 30, 2021Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: James Michael GARDNER, Sirena LU, Frank D. DERRYBERRY, Michael W. CUMBIE
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Publication number: 20210291520Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: June 3, 2021Publication date: September 23, 2021Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 11034151Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: June 15, 2021Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20200398562Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20200398563Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20200398564Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: December 24, 2020Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 10029259Abstract: A slot extender includes a reservoir. The reservoir includes a reservoir floor defining a drain opening, a continuous reservoir sidewall extending from the reservoir floor, and a concave fillet running along at least a portion where the reservoir sidewall joins the reservoir floor. The concave fillet has a variable radius.Type: GrantFiled: July 14, 2017Date of Patent: July 24, 2018Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R Esterberg, Frank D Derryberry, Richard W Seaver, Christie Dudenhoefer
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Publication number: 20170312750Abstract: A slot extender includes a reservoir. The reservoir includes a reservoir floor defining a drain opening, a continuous reservoir sidewall extending from the reservoir floor, and a concave fillet running along at least a portion where the reservoir sidewall joins the reservoir floor. The concave fillet has a variable radius.Type: ApplicationFiled: July 14, 2017Publication date: November 2, 2017Inventors: Dennis R. ESTERBERG, Frank D. DERRYBERRY, Richard W. SEAVER, Christie DUDENHOEFER
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Patent number: 9776186Abstract: A slot extender includes a reservoir. The reservoir includes a reservoir floor defining a drain opening, a continuous reservoir sidewall extending from the reservoir floor, and a concave fillet running along at least a portion where the reservoir sidewall joins the reservoir floor. The concave fillet has a variable radius.Type: GrantFiled: January 8, 2013Date of Patent: October 3, 2017Assignee: Hewlett-Packard Development Company, L.P.Inventors: Dennis R Esterberg, Frank D Derryberry, Richard W Seaver, Christie Dudenhoefer
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Publication number: 20150336100Abstract: A slot extender includes a reservoir. The reservoir includes a reservoir floor defining a drain opening, a continuous reservoir sidewall extending from the reservoir floor, and a concave fillet running along at least a portion where the reservoir sidewall joins the reservoir floor. The concave fillet has a variable radius.Type: ApplicationFiled: January 8, 2013Publication date: November 26, 2015Applicant: Hewlett-Packard Development Company, L.P.Inventors: Dennis R ESTERBERG, Frank D DERRYBERRY, Richard W SEAVER, Christie DUDENHOEFER