Patents by Inventor Frank D. Madrigal

Frank D. Madrigal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package assembly with wire end above a topmost component
    Patent number: 9978722
    Abstract: Embodiments of the present disclosure describe integrated circuit (IC) package assemblies having one or more wires that extend beyond a topmost component in the IC package assembly, computing devices incorporating the IC package assemblies, methods for formation of the IC package assemblies, and associated configurations. An IC package assembly may include a substrate having a first side and a second side opposite the first side, an IC die having a first side and a second side opposite the first side, where the first side of the IC die faces the first side of the substrate, a wire electrically coupled with the IC die, where an end of the wire extends beyond a topmost component in the IC package assembly, and an overmold coupled with the topmost component. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: May 22, 2018
    Assignee: Intel Corporation
    Inventors: William T. Glennan, Frank D. Madrigal
  • INTEGRATED CIRCUIT PACKAGE ASSEMBLY WITH WIRE END ABOVE A TOPMOST COMPONENT
    Publication number: 20180090468
    Abstract: Embodiments of the present disclosure describe integrated circuit (IC) package assemblies having one or more wires that extend beyond a topmost component in the IC package assembly, computing devices incorporating the IC package assemblies, methods for formation of the IC package assemblies, and associated configurations. An IC package assembly may include a substrate having a first side and a second side opposite the first side, an IC die having a first side and a second side opposite the first side, where the first side of the IC die faces the first side of the substrate, a wire electrically coupled with the IC die, where an end of the wire extends beyond a topmost component in the IC package assembly, and an overmold coupled with the topmost component. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: September 29, 2016
    Publication date: March 29, 2018
    Inventors: William T. Glennan, Frank D. Madrigal