Abstract: Electronic components on an assembly carrier are connected with conductor paths on the assembly carrier by welding a first ball-shaped end of a first wire to an electronic component, welding a first ball-shaped end of a second wire to the conductor path, and welding second broadened ends of both wires to a connection surface located between the electronic component and the conductor path.

Abstract: An anisotropically conducting adhesive includes an adhesive base material; and conductive particles which are dispersed in the adhesive base material and which have provided on the surface of the conductive particles a separating agent comprised of at least one ligand which is selected from the group consisting of triphenylphosphine and propionic acid, which decomposes during use of the anisotropically conducting adhesive in an adhesion process and which is non-polymeric. A method for producing a bonded, electrically conductive connection between a plurality of strip connectors includes (a) providing the foregoing anisotropically conducting adhesive; (b) positioning strip connectors on opposite surfaces of the anisotropically conducting adhesive; (c) applying pressure to the anisotropically conducting adhesive and the strip connectors; and (d) decomposing the at least one ligand of the anisotropically conducting adhesive.

Abstract: A method for joining an electrical connection (10) of a non-packaged IC component (15) with a conductive strip (35) on a substrate (30). An easy to metallize layer (20) preferably is applied to the surface of an electrical connection (10) that is to be connected. The surface (10, 20) to be connected of connection (10) is arranged at a distance to and facing a contact surface (45) of a conductive strip (35) on a substrate (30). An electrically conductive material (50) for filling in the free volume between the two surfaces (10, 20; 45) to be connected is applied simultaneously to the contact surface (45) and the surface (10, 20) to be connected.

Abstract: The resistance material of a thick-film resistor is applied to a substrate in a layer having a configuration that tapers in a direction transverse to the direction of flow of current and the conductive leads are provided in contact with the tapering edges of the layer. A small incision on the shorter side of the layer between the tapering edges to which the leads are applied will have a relatively large effect on the resistance value without great effect on the amount of the area that determines the power rating of the resistor, so that trimmming by such an incision can be done quickly and the resistance change with progressive incision is more uniform than in the case of a resistor layer of rectangular configuration.