Patents by Inventor Frank Durso

Frank Durso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20080003351
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: September 4, 2007
    Publication date: January 3, 2008
    Applicant: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Patent number: 7279108
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: October 9, 2007
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20060124583
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: February 6, 2006
    Publication date: June 15, 2006
    Applicant: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Patent number: 7034231
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: April 25, 2006
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with embedded resistors
    Publication number: 20040245210
    Abstract: A process is revealed whereby resistors can be manufactured integral with a circuit board by printing the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching is discussed as a technique for improving the uniformity and consistency of the printed resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the printed resistors.
    Type: Application
    Filed: June 9, 2003
    Publication date: December 9, 2004
    Inventors: Peter Kukanskis, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with integral plated resistors
    Patent number: 6767445
    Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
    Type: Grant
    Filed: October 16, 2002
    Date of Patent: July 27, 2004
    Inventors: Peter Kukanskis, Frank Durso, David Sawoska
  • Method for the manufacture of printed circuit boards with integral plated resistors
    Publication number: 20040076743
    Abstract: The present invention is a process for manufacturing resistors integral with the printed circuit board by plating the resistors onto the insulative substrate. The invention uses a mask during the activation step so as to selectively activate only selected portions of the surface thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used. The process of the instant invention produced printed circuit boards having greater uniformity and reliability as compared to the prior art.
    Type: Application
    Filed: October 16, 2002
    Publication date: April 22, 2004
    Inventors: Peter Kukanskis, Frank Durso, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20030205551
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: April 21, 2003
    Publication date: November 6, 2003
    Applicant: MacDermid, Incorporated
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Patent number: 6585904
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Grant
    Filed: February 15, 2001
    Date of Patent: July 1, 2003
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Method for the manufacture of printed circuit boards with plated resistors
    Publication number: 20020135459
    Abstract: A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.
    Type: Application
    Filed: February 15, 2001
    Publication date: September 26, 2002
    Inventors: Peter Kukanskis, Dennis Fritz, Frank Durso, Steven Castaldi, David Sawoska
  • Process for treating metal surfaces
    Patent number: 6020029
    Abstract: A process for treating metal surfaces that includes first contacting the metal surface with a particular acidic peroxide adhesion promoting composition, followed by contacting that metal surface with an alkaline solution. This treatment is particularly suitable for treating metal surfaces used in printed circuit multilayer construction.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: February 1, 2000
    Assignee: MacDermid, Incorporated
    Inventors: Donald Ferrier, Frank Durso