Abstract: An apparatus and method is disclosed for holding semiconductor wafer samples that are to be stained with treatment chemicals prior to microanalysis. The apparatus includes at least one slotted support member and a handle which may be attached to or integral with the support member. The number of slots in the support member correspond to at least the number of wafer samples that are to be retained in the slots. Preferably, three support members are spaced parallel to each other and the slots in all three support members are aligned in parallel planes so that larger wafer samples can be seated within the slots on more than one support member and the handle is attached perpendicular to and bisects each member. Also two bending rods are disposed on opposite sides of the handle perpendicular to the support members for bending the support members to open the slots to receive the wafer samples.

Abstract: A method for staining a plurality of semiconductor wafers and wafer samples with a chemical. The method includes gripping first and second semiconductor wafers and orienting the second semiconductor wafer such that it is substantially coplanar with the first semiconductor wafer and suspending the first and second semiconductor wafers such that at least portions thereof extend into the chemical. The method may also include gripping a first semiconductor wafer and a second semiconductor wafer that has a different size from the first and suspending first and second semiconductor wafers such that at least portions thereof extend into the chemical.

Abstract: A method for staining a portion of a semiconductor wafer sample with a semiconductor treatment chemical. On embodiment of the method includes gripping the semiconductor wafer sample in a first openly biasable slot in a flexible bar and suspending the semiconductor wafer into the chemical. Other embodiments of the method may further include gripping plural semiconductor wafer samples in openly biasable sots in flexible bars to enable a plurality of semiconductor wafer samples to be treated with a semiconductor treatment chemical.

Abstract: A method for contacting at least one semiconductor wafer with a chemical solution. The method includes providing a support member constructed to support at least one semiconductor wafer in a desired orientation. The method further includes orienting the support member relative to a container holding a chemical solution such that at least a portion of each semiconductor wafer that is supported by the support member is contacted by the chemical solution within the container.

Abstract: An apparatus for retaining at least one wafer sample in a desired orientation. The apparatus includes at least one support member that contains at least one slot having outwardly biasable opposing faces adapted to grip at least a portion of at least one wafer sample therein in a desired orientation. In addition, a handle may be attached to the at least one support member for facilitating manipulation and/or support thereof. Bending bars may also be attached to the at least one support member to facilitate application of a bending force to the at least one support member to aide in causing the at least one slot therein to open. When in an open position, each slot can receive at least a portion of a corresponding wafer sample therein or release a corresponding wafer sample therefrom.

Abstract: An apparatus for retaining at least one semiconductor wafer sample in a desired orientation. The apparatus includes at least one support member that contains at least one slot constructed to grip at least a portion of at least one semiconductor wafer sample therein in a desired orientation. In addition, a handle may be attached to the support members for facilitating manipulation and/or support thereof. Bending bars may also be attached to support members to facilitate application of a bending force to the support members to cause the slots therein to open. When in an open position, each slot can receive at least a portion of a corresponding semiconductor wafer sample therein or release a corresponding semiconductor wafer sample therefrom.

Abstract: An apparatus and method is disclosed for contacting samples with liquids. The apparatus includes a slotted support member positionable with respect to a container to allow a sample retained within the slot to be contacted by chemicals within the container. The slot in the support member is defined by opposing faces that are outwardly biasable and extend from a base. Preferably, three support members are spaced parallel to each other. The slots in the three support members are preferably aligned in parallel planes to allow larger wafer samples to be retained within the slots on more than one support member. A handle is preferably attached perpendicular to and bisecting each support member. Two bending rods are preferably disposed on opposite sides of the handle perpendicular to the support members. The bending bars are positioned to allow the support members to bent over the bars thereby outwardly biasing the opposing faces and opening the slots to receive the samples.