Patents by Inventor Frank E. Polka

Frank E. Polka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-level semiconductor package
    Patent number: 4994897
    Abstract: A single-in-line semiconductor package uses a multi-level heatsink having patterned conductors surrounding the semiconductor device. The patterned conductors are electrically isolated from the heatsink. Short bond wires are used to connect the semiconductor device to the patterned conductors. This arrangement eliminates the need for bonding shelves when bonding the leads and also increases the resistance of the bond wires from being swept away during encapsulation.
    Type: Grant
    Filed: October 26, 1989
    Date of Patent: February 19, 1991
    Assignee: Motorola, Inc.
    Inventors: Theodore R. Golubic, Frank E. Polka, Brian A. Webb