Abstract: The present disclosure provides a method for manufacturing an electrical contact element, the method comprising forming a structuring layer with a predefined structure on a basic layer, adding an electrical contact element layer by depositing electrically conductive material on the basic layer via the structuring layer according to the predefined structure, removing the structuring layer, and detaching the electrical contact element layer from the basic layer. Further, the present disclosure provides a respective electrical contact element.

Abstract: The present disclosure provides a method for manufacturing an electrical contact element on a circuit structure, the method comprising depositing a separation layer on a carrier substrate, wherein the carrier substrate comprises the circuit structure, forming a structuring layer with a predefined structure on a basic layer that is arranged between the separation layer and the structuring layer, adding an electrical contact element layer by depositing electrically conductive material on the basic layer via the structuring layer according to the predefined structure, and removing the separation layer, and the structuring layer. Further, the present disclosure provides a respective measurement application device.

Abstract: The disclosure relates to a water treatment system which may include at least one reverse osmosis cartridge, at least one filtration cartridge, at least one pump and an enclosure.

Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Abstract: A method for producing a smartcard body for receiving a semiconductor chip includes forming at least one lead frame of the smartcard body in a carrier material connected by at least one material strip. Surrounding the at least one lead frame is an electrically insulating casing having a cavity for receiving the semiconductor chip. Either before or during the forming of the casing, the at least one material strip is separated or severed, so that the material strip is separated into a first strip part connected with the carrier material and a second strip part connected with the lead frame forming an interspace there between. When forming the casing at least a portion of the first strip part as well as at least a portion of the second strip part of the at least one material strip is comprised by the casing.

Abstract: A clip for a flat flexible cable includes a first closure member having a top surface, a bottom surface and a side surface, a second closure member having a top surface, a bottom surface and a side surface, and a hinge member for hingedly connecting the first and second closure members. The clip includes a locating feature for locating the clip and preventing movement of the clip relative to the flat cable. In one embodiment, the locating feature comprises a post extending from a surface of the one of the first and second closure members that is received in an aperture in the flat cable. In another embodiment, the locating feature comprises one or more nibs projecting from the side surfaces of the clip that are received in cutouts formed in the side walls of the flat cable.