Patents by Inventor Frank Ellinger

Frank Ellinger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Component arrangement
    Patent number: 9786426
    Abstract: Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: October 10, 2017
    Assignee: Technische Universitat Dresden
    Inventors: Frank Ellinger, Ronny Henker, Guido Belfiore, Christian Thiele
  • COMPONENT ARRANGEMENT
    Publication number: 20160141092
    Abstract: Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier.
    Type: Application
    Filed: June 25, 2014
    Publication date: May 19, 2016
    Inventors: Frank Ellinger, Ronny Henker, Guido Belfiore, Christian Thiele