Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

Abstract: A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

Abstract: The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.

Abstract: A method of determining a first distance between a probe and a wafer held by a wafer probe station includes adjusting a microscope at a specific magnification; moving the microscope perpendicularly relative to a chuck to focus on the chuck to obtain a clear image of the chuck; defining a specific position of the microscope after the clear image of the chuck is obtained; maintaining the specific magnification of the microscope and moving the microscope perpendicularly relative to the chuck from the specific position by a travelling distance to focus on the probe to obtain a clear image of the probe; and determining the travelling distance minus a thickness of a wafer to be placed on a side of the chuck facing to the microscope as the first distance between the probe and the wafer.

Abstract: A method of positioning probe tips relative to pads includes: focusing on each of the probe tips in a first image as viewed by a microscope and collecting the coordinates of the corresponding probe tip relative to a first reference point in the first image; focusing on each of the pads in a second image as viewed by the microscope and collecting the coordinates of the corresponding pad relative to a second reference point in the second image, a relative position of the second reference point to the first reference point being predetermined; matching the pads with the probe tips when the quantity of the probe tips and the pads are equal while minimizing a maximum value of the distances calculated between each of the probe tips and the corresponding pad; and moving the probe tips to touch the pads with the maximum value minimized.

Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

Abstract: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle ? in a range of 0 to 180°.

Abstract: Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further may include performing a process operation on the selected wafer with the wafer processing system and undocking the first wafer cassette from the wafer processing system while performing the process operation. The methods also may include docking a second wafer cassette (which may be the same as or different from the first wafer cassette) on the wafer processing system, inventorying the second wafer cassette with the wafer processing system, and/or subsequently placing the selected wafer in the second wafer cassette. The systems may include wafer processing systems that include a controller that is programmed to perform at least a portion of the methods.

Abstract: The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the probes (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern.

Abstract: The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle ? in a range of 0 to 180°.

Abstract: The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern.

Abstract: In a method for producing semiconductor components, in which chips are structured, tested, and isolated into dies on a wafer, in the event of a wafer being broken during the method, undamaged chips of a fragment of the wafer delimited by at least one edge section and at least one fracture contour are processed further as usual. The method has the result that the yield of usable chips is significantly increased in relation to the discarding and disposal of broken wafers provided in the prior art. The average production costs of electronic components and the loss of valuable semiconductor materials and the costs for the disposal of the fragments viewed as discards up to this point are thus significantly reduced.

Abstract: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

Abstract: A method is disclosed for measurement of wafers and other semiconductor components in a probe station, which serves for examination and testing of electronic components. The device under test is held by a chuck and at least one electric probe by a probe support and the device under test and the probe are selectively positioned relative to each other by a positioning device with electric drives and the device under test is contacted. The drive of the positioning device remains in a state of readiness until establishment of contact and is switched off after establishment of contact and before measurement of the device under test.

Abstract: In a device and a method for positioning an object, a drive of a movement device is controlled. To this end, a visual joystick is actuated, as a result of which a moveable actuator is moved, at least linearly by means of a display of a control unit of the movement device, into a position, in which a direction of movement, which can be implemented with the drive, is displayed symbolically. The drive for the movement of the object in the displayed direction of movement is initiated by means of a switching function of the actuator.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.