Abstract: The production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.

Abstract: A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.

Abstract: The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

Abstract: The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are smaller than the lateral dimensions of the functional substrate. For this purpose, a plate-like cover substrate is mounted on a carrier substrate. Then, on the uncovered side of the plate-like cover substrate, trenches are inserted, so that a composite part is obtained with the carrier substrate and individual covering parts that are separated from each other by the trenches, but interconnected by the carrier substrate. The covering parts of the composite part are connected with a functional substrate with a plurality of components. Then, the connection of the covering parts is dissolved with the carrier substrate, and the carrier substrate is removed, so that a composite is obtained with the functional substrate and a plurality of covering parts that cover functional areas.

Abstract: The invention relates to the production of optoelectronic components, optical components being mounted in the composite wafer. Provided to this end is a method for producing optoelectronic components, in particular image signal acquiring or image signal outputting components, in the case of which optical components are respectively provided, picked up and mounted on a wafer, the optical components preferably respectively being positioned individually or in groups relative to the position of assigned optoelectronic or optical components of the wafer or of a wafer to be connected thereto.