Abstract: Methods, apparatuses and systems directed to pattern learning, recognition, and metrology. In some particular implementations, the invention provides a flexible pattern recognition platform including pattern recognition engines that can be dynamically adjusted to implement specific pattern recognition configurations for individual pattern recognition applications. In certain implementations, the present invention provides for methods and systems suitable for analyzing and recognizing patterns in biological signals such as multi-electrode array waveform data. In other implementations, the present invention also provides for a partition configuration where knowledge elements can be grouped and pattern recognition operations can be individually configured and arranged to allow for multi-level pattern recognition schemes. In other implementations, the present invention provides methods and systems for dynamic learning of patterns in supervised and unsupervised manners.

Abstract: Methods, apparatuses and systems directed to pattern learning, recognition, and metrology. In some particular implementations, the invention provides a flexible pattern recognition platform including pattern recognition engines that can be dynamically adjusted to implement specific pattern recognition configurations for individual pattern recognition applications. In certain implementations, the present invention provides for methods and systems suitable for analyzing and recognizing patterns in biological signals such as multi-electrode array waveform data. In other implementations, the present invention also provides for a partition configuration where knowledge elements can be grouped and pattern recognition operations can be individually configured and arranged to allow for multi-level pattern recognition schemes. In other implementations, the present invention provides methods and systems for dynamic learning of patterns in supervised and unsupervised manners.

Abstract: Methods, apparatuses and systems directed to pattern learning, recognition, and metrology. In some particular implementations, the invention provides a flexible pattern recognition platform including pattern recognition engines that can be dynamically adjusted to implement specific pattern recognition configurations for individual pattern recognition applications. In certain implementations, the present invention provides for methods and systems suitable for analyzing and recognizing patterns in biological signals such as multi-electrode array waveform data. In other implementations, the present invention also provides for a partition configuration where knowledge elements can be grouped and pattern recognition operations can be individually configured and arranged to allow for multi-level pattern recognition schemes. In other implementations, the present invention provides methods and systems for dynamic learning of patterns in supervised and unsupervised manners.

Abstract: Methods, apparatuses and systems directed to pattern learning, recognition, and metrology. In some particular implementations, the invention provides a flexible pattern recognition platform including pattern recognition engines that can be dynamically adjusted to implement specific pattern recognition configurations for individual pattern recognition applications. In certain implementations, the present invention provides for methods and systems suitable for analyzing and recognizing patterns in biological signals such as multi-electrode array waveform data. In other implementations, the present invention also provides for a partition configuration where knowledge elements can be grouped and pattern recognition operations can be individually configured and arranged to allow for multi-level pattern recognition schemes. In other implementations, the present invention provides methods and systems for dynamic learning of patterns in supervised and unsupervised manners.

Abstract: Methods, apparatuses and systems directed to pattern learning, recognition, and metrology. In some particular implementations, the invention provides a flexible pattern recognition platform including pattern recognition engines that can be dynamically adjusted to implement specific pattern recognition configurations for individual pattern recognition applications. In certain implementations, the present invention provides for methods and systems suitable for analyzing and recognizing patterns in biological signals such as multi-electrode array waveform data. In other implementations, the present invention also provides for a partition configuration where knowledge elements can be grouped and pattern recognition operations can be individually configured and arranged to allow for multi-level pattern recognition schemes. In other implementations, the present invention provides methods and systems for dynamic learning of patterns in supervised and unsupervised manners.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method simultaneously directs the first and second laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row, so as to selectively irradiate structures in the row with one or more of the first and second laser beams simultaneously.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second pulsed laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs respective first and second pulses from the first and second pulsed laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto non-adjacent first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of pulsed laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first pulsed laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second pulsed laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs respective first and second pulses from the first and second pulsed laser beams onto distinct first and second structures in the row. The method moves the first and second laser beam axes relative to the semiconductor substrate substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor wafer using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links. The structures are arranged in rows and may be processed in either an on-axis mode or a cross-axis mode. In the on-axis mode, the beam spots fall on structures in the same row as they move along the row. In the cross-axis mode, the beam spots fall on structures in different rows as they move along the rows.

Abstract: Methods and systems selectively irradiate structures on or within a semiconductor substrate using a plurality of laser beams. The structures are arranged in a row extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects the semiconductor substrate and a second laser beam that propagates along a second laser beam axis that intersects the semiconductor substrate. The method directs the first and second laser beams onto distinct first and second structures in the row. The second spot is offset from the first spot by some amount in a direction perpendicular to the lengthwise direction of the row. The method moves the first and second laser beam axes relative to the semiconductor substrate along the row substantially in unison in a direction substantially parallel to the lengthwise direction of the row.

Abstract: A calibration system within an optical inspection apparatus comprising a sensor, lens, fiducials, and a CPU. The CPU is configured to receive information from the sensor relating to the fiducial coordinate system and the sensor coordinate system, and the fiducials are used to determine a physical relationship between the sensor coordinates and fiducial coordinates. The calibration system has a means for calibrating the inspection system and measuring critical dimensions of an object in an accurate manner on-the-fly without additional set-up or manual calibration of the system.

Abstract: A calibration system within an optical inspection apparatus comprising a sensor, lens, fiducials, and a CPU. The CPU is configured to receive information from the sensor relating to the fiducial coordinate system and the sensor coordinate system, and the fiducials are used to determine a physical relationship between the sensor coordinates and fiducial coordinates. The calibration system has a means for calibrating the inspection system and measuring critical dimensions of an object in an accurate manner on-the-fly without additional set-up or manual calibration of the system.

Abstract: A universal modular controller for controlling remote events over short or long time periods. The controller includes a clock, a counter and one or more decoder and logic networks. The clock may have a pulse rate range of from a few microseconds to more than an hour. The counter preferably includes four counter stages. Each of the decoder and logic networks is connected to the data output of the counter stage s and each decoder and logic network includes a programmable switching and logic network. This makes it possible to provide long and short duration continuous signals as well as individual or repeating pulse signals for control of various types of devices or loads. The controller may control one or many devices, in a simple or complex manner and over short or long time periods.