Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.

Abstract: Improved preamplifier circuits for converting single-ended input current signals to differential output voltage signals, including first and second transimpedance amplifiers with input transistors operating according to bias currents from a biasing circuit, output transistors and adjustable feedback impedances modified using an automatic gain control circuit, as well as a reference circuit controlling the bias currents according to an on-board reference current and the single-ended input or the differential output voltage signals from the transimpedance amplifiers.

Abstract: Improved preamplifier circuits for converting single-ended input current signals to differential output voltage signals, including first and second transimpedance amplifiers with input transistors operating according to bias currents from a biasing circuit, output transistors and adjustable feedback impedances modified using an automatic gain control circuit, as well as a reference circuit controlling the bias currents according to an on-board reference current and the single-ended input or the differential output voltage signals from the transimpedance amplifiers.

Abstract: The invention relates to an electronic device that includes a plurality of buffers and a phase locked loop. For each buffer a fractional divider is provided which is coupled to receive the output from the phase locked loop and configured to feed a divided output signal to a respective buffer. A spread spectrum clock control logic stage in the spread spectrum clock (SSC) is provided which is configured to individually adjust a value of the division of each fractional divider in order to individually and independently modulate the output signal of each fractional divider according to a spread spectrum modulation scheme.

Abstract: The invention relates to an electronic device that includes a plurality of buffers and a phase locked loop. For each buffer a fractional divider is provided which is coupled to receive the output from the phase locked loop and configured to feed a divided output signal to a respective buffer. A spread spectrum clock control logic stage in the spread spectrum clock (SSC) is provided which is configured to individually adjust a value of the division of each fractional divider in order to individually and independently modulate the output signal of each fractional divider according to a spread spectrum modulation scheme.

Abstract: Here, a driver for an light emitting diode (LED) is provided. Within this driver, several differential pairs of bipolar transistors are employed in an input stage and output stage along with a control loop. Collectively, these components operate together to drive the LED with a low headroom voltage while still achieving high driver performance in terms of edge speed and jitter.

Abstract: Here, a driver for an light emitting diode (LED) is provided. Within this driver, several differential pairs of bipolar transistors are employed in an input stage and output stage along with a control loop. Collectively, these components operate together to drive the LED with a low headroom voltage while still achieving high driver performance in terms of edge speed and jitter.

Abstract: A CMOS LC-tank oscillator includes a pair of symmetric inductors and a differential pair of transistors. The inductors have a first one of their terminals interconnected at a supply node to which a voltage supply is applied through a supply resistor and a second terminal connected to the drain of a respective one of the transistors. The transistors have their sources interconnected at a tail node which is connected to ground through a tail resistor. A current control loop controls a core current between the supply and tail nodes so as to keep a voltage drop across the tail resistor at a level determined by a reference voltage. The current control loop keeps the core current between the supply and tail nodes at the required level so that a resistor may replace the upstream supply voltage regulator and another resistor may replace the downstream bias regulator. Consequently, sources of noise injected into the LC-tank type oscillator are eliminated.

Abstract: A CMOS LC-tank oscillator includes a pair of symmetric inductors and a differential pair of transistors. The inductors have a first one of their terminals interconnected at a supply node to which a voltage supply is applied through a supply resistor and a second terminal connected to the drain of a respective one of the transistors. The transistors have their sources interconnected at a tail node which is connected to ground through a tail resistor. A current control loop controls a core current between the supply and tail nodes so as to keep a voltage drop across the tail resistor at a level determined by a reference voltage. The current control loop keeps the core current between the supply and tail nodes at the required level so that a resistor may replace the upstream supply voltage regulator and another resistor may replace the downstream bias regulator. Consequently, sources of noise injected into the LC-tank type oscillator are eliminated.