Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

Abstract: A hermetically sealed LED light is provided that includes a ceramic base with a plurality of LEDs and a metal cap soldered thereto and a channel for introducing an electrical, optical, or mechanical component.

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

Abstract: A base body for a light conversion device and/or an illumination device is configured as a heat sink. The base body has a front side which is configured to mount a light conversion element on the base body. The base body includes an indicator for positioning/alignment of a light conversion element on the base body, and/or an indicator for positioning/alignment of the base body relative to a component for retention of the base body.

Abstract: A lighting device is provided that includes light emitting unit that emits primary light and a light conversion element that is illuminated with the primary light and emits secondary light of another wavelength. The light conversion element has a front side defining a primary light receiving surface that received the primary light and a secondary light emitting surface that emits the secondary light. The light conversion element has a variable thickness at the primary light receiving surface and/or in the secondary light emitting surface.

Abstract: Lighting devices for providing a secondary light with high luminance are provided. The lighting devices include a light conversion element and a light emitting unit with a light source that emits a primary light. The light conversion element has a front side illuminated with the primary light and, in response to the primary light, to emit a secondary light from the front side. The secondary light has a larger wavelength than the primary light.

Abstract: A light conversion device is provided that includes a main body and a light conversion arrangement. The main body includes heatsink and is on a back side of the light conversion arrangement. The light conversion arrangement has a front side with light conversion elements separated from one another at least regionally by a trench. The light conversion elements, when irradiated with primary light on the front side, are configured to emit secondary light having a different wavelength from the front side.

Abstract: Light conversion devices and lighting devices having such conversion devices are provided. The conversion device includes a light conversion element having a front side and a coating arrangement. The front side is configured to be illuminated with primary light and to emit secondary light having another wavelength or a wavelength range. The coating arrangement is on the front side and has at least one coating layer.

Abstract: A hermetically sealed package includes: a heat-dissipating base substrate configured for dissipating heat from the hermetically sealed package; a cap arranged on the heat-dissipating base substrate, the cap and the heat-dissipating base substrate jointly forming at least a part of the package; at least one functional area hermetically sealed by the package; at least one laser bonding line configured for hermetically sealing the package, the laser bonding line having a height perpendicular to a bonding plane of the laser bonding line.

Abstract: A stable, hermetically sealed, partially optically transparent package for use to protect optoelectronic components is provided. The package has good cooling for the installed circuit elements and is as stable in relation to temperature and UV. The package has a cap with a frame made of a nitride ceramic and a glass element. The frame has an opening and the glass element hermetically closes the opening. The glass is fused onto the nitride ceramic and is fixed in contact with the nitride ceramic of the frame.

Abstract: An optoelectronic module is provided that has a carrier element, an optoelectronic element on the carrier element, a cover, and a cavity. The cover has a frame surrounding the optoelectronic element and connected to the carrier element. A glass element is on the frame lying substantially opposite the carrier element for the input and/or output of electromagnetic radiation. The cavity is inside a volume that is delimited by an inner surface of the cover and a surface of the carrier element. The optoelectronic element is arranged in the cavity and enclosed by the cover hermetically and/or in an autoclavable fashion. A filler material is in the cavity to compensate for an expansion of a volume occupied by the filler material and has a first deformable compensation volume, which is arranged adjacent to a subregion of the cover and/or of the carrier element.

Abstract: A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

Abstract: A lighting device includes: at least one laser light source configured to emit a light beam; and a light conversion element associated with the at least one laser light source and arranged in the beam path of at least one light beam generated by at least one laser light source such that at least a portion of the light beam emitted by the at least one laser light source is directed onto the light conversion element, and in such a way that a laser light spot is illuminated on a face of the light conversion element facing the incident light beam, the light conversion element comprising a material which, through scattering, absorption and conversion of the incident laser light, emits and scatters light of a larger wavelength.

Abstract: A hermetically sealed LED light is provided that includes a ceramic base with a plurality of LEDs and a metal cap soldered thereto and a channel for introducing an electrical, optical, or mechanical component.

Abstract: Light conversion devices and lighting devices having such conversion devices are provided. The conversion device includes a light conversion element having a front side and a coating arrangement. The front side is configured to be illuminated with primary light and to emit secondary light having another wavelength or a wavelength range. The coating arrangement is on the front side and has at least one coating layer.

Abstract: Lighting devices for providing a secondary light with high luminance are provided. The lighting devices include a light conversion element and a light emitting unit with a light source that emits a primary light. The light conversion element has a front side illuminated with the primary light and, in response to the primary light, to emit a secondary light from the front side. The secondary light has a larger wavelength than the primary light.

Abstract: A base body for a light conversion device and/or an illumination device is configured as a heat sink. The base body has a front side which is configured to mount a light conversion element on the base body. The base body includes an indicator for positioning/alignment of a light conversion element on the base body, and/or an indicator for positioning/alignment of the base body relative to a component for retention of the base body.

Abstract: A lighting device is provided that includes light emitting unit that emits primary light and a light conversion element that is illuminated with the primary light and emits secondary light of another wavelength. The light conversion element has a front side defining a primary light receiving surface that received the primary light and a secondary light emitting surface that emits the secondary light. The light conversion element has a variable thickness at the primary light receiving surface and/or in the secondary light emitting surface.

Abstract: A light conversion device is provided that includes a main body and a light conversion arrangement. The main body includes heatsink and is on a back side of the light conversion arrangement. The light conversion arrangement has a front side with light conversion elements separated from one another at least regionally by a trench. The light conversion elements, when irradiated with primary light on the front side, are configured to emit secondary light having a different wavelength from the front side.

Abstract: A hermetically sealed LED light is provided that includes a ceramic base with a plurality of LEDs and a metal cap soldered thereto and a channel for introducing an electrical, optical, or mechanical component.