Abstract: A method for altering an electrical connection in an electronic package including one or more semiconductor chips overlying, i.e., mounted directly onto, or mounted onto one or more modules which are mounted onto, a substrate such as a printed circuit card or printed circuit board, as well as the resulting electronic package, is disclosed. In accordance with a preferred embodiment of the inventive method, at least one plated, solder-filled hole in the substrate is drilled out to eliminate an unwanted electrical connection. A solder region, e.g., a solder ball, is inserted into the drilled out hole into contact with an electrically conductive member, e.g., an electrically conductive pin, extending from, for example, a module into the hole. A cylinder, including a central core of electrically conductive material, encircled by an annulus of electrically insulating material, is inserted into the hole.

Abstract: Water soluble fluxing bath compositions have particular value in immersion soldering of metallic surfaces and electrical connections in that they are characterized by good thermal and chemical stability and easy removal of flux residues without corrosion or insulation resistance hazards. The compositions comprise from about 2 to 8 percent by weight of chelating agents or salts dissolved in a solvent, such as glycerol. In some instances from about 0.1 to 1.0 percent of an inorganic acid, such as hydrochloric acid may be added.