Abstract: Disclosed is a dipole array antenna that is particularly useful at UHF and microwave frequencies. In an exemplary embodiment, the antenna is comprised of two dipole radiating elements--a driven dipole of length L1 and an unfed element closely spaced from the driven element, of length L2. The ratio L1/L2 is at least 1.1, and may be optimally set at about 1.3. Preferably, at a reference frequency in which VSWR is minimum, the length L2 of the unfed element is less than 0.45 wavelengths, and optimally, is in the range of 0.39-0.42 wavelengths, with dipole spacing in the range of 0.07 to 0.11 wavelengths at the reference frequency. Advantageously, the antenna exhibits a low VSWR in a 50 ohm system over an operating frequency band, whereby a matching network can be avoided. High gain and front-to-back ratio is also realizable while antenna size is kept small.

Abstract: A portable or notebook type computer communication interface that permits portable computers to be reliably used in a data processing network. The interface involves communication circuitry, special device inputs and power monitoring and charging. A flexible portable computer wireless time and frequency division network is formed using a time and frequency division multiplexed communication channel assignment feature that together with a wireless link establishes a unique direct communication channel between data processing devices on different levels with data packet type transmission security. The principle permits each portable computer in the network to communicate with any other and any and all can transmit and receive at the same time.

Abstract: The antenna is a hybrid microstrip and reflector antenna having a planar patch antenna mounted to an upper surface of an insulated planar substrate. The substrate is coupled to a ground plane by one or more insulated couplers so as to form an airgap therebetween. A coaxial cable connectable to a transceiver is coupled to the bottom surface of the ground plane at the outer conductor thereof and the inner conductor is coupled to a feed pin which passes through the ground plane and protrudes through the surface of the patch. The feed pin is secured to the patch by soldering.