Abstract: One aspect of the application can provide a system and method for replacing a failing node with a spare node in a non-uniform memory access (NUMA) system. During operation, in response to determining that a node-migration condition is met, the system can initialize a node controller of the spare node such that accesses to a memory local to the spare node are to be processed by the node controller, quiesce the failing node and the spare node to allow state information of processors on the failing node to be migrated to processors on the spare node, and subsequent to unquiescing the failing node and the spare node, migrate data from the failing node to the spare node while maintaining cache coherence in the NUMA system and while the NUMA system remains in operation, thereby facilitating continuous execution of processes previously executed on the failing node.

Abstract: A sink mounting device includes a weld bracket, a movable clip member and a hanger assembly used to movably couple the clip member to the weld bracket. The weld bracket is secured to a side portion of a sink bowl and the movable clip is used to engage an overhanging portion of the underside of the countertop. The clip includes a base having an axially positioned through-opening, an elongated arm member which extends longitudinally in a direction axially from the base, a projecting finger, which extends laterally from the end of the arm remote from the base, and includes a locating flange which, when the sink mounting device is operated, engages the hanger assembly, weld bracket and/or sink bowl at a limit position to prevent further rotation of the movable arm about the axis.

Abstract: Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe+Ni), and the selective spot plating is silver 100 to 150 microinches thick.

Abstract: A slitter machine for slitting a film sheet wound on a core in a roll to obtain desired widths of film sheet for laminating onto metallic substrates of semiconductor devices comprises a main frame, notches on the main frame for rotatably supporting the roll on the frame, a rotatable knife blade for slitting the roll sheet into a strip of desired width, a tiltable knife blade mounting plate on the frame for mounting the knife blade on the frame, guide tracks adjusting the lateral position of the knife blade to adjust the width of the strip being cut, an air cylinder for pressing the knife blade into the rolled sheet to cut the sheet into strips of the desired width, and a sensing roller for limiting the depth of the cut.

Abstract: Lead frames for microchips and other integrated circuit dies are produced by a continuous manufacturing method and apparatus in which silver spot plating is done prior to etching away unwanted portions of the lead frame substrate. A flexible substrate of a metal alloy is fed continuously from a reel, then spot plated with silver, coated with a photosensitive material, and exposed to intensive light in an exposure chamber using a photoresist or masking tool of predetermined design. The exposed photosensitive material is developed chemically, etched in acid, and placed in a chemical solution to remove any remaining unwanted material. The strip is then dried, cut to predetermined lengths and boxed for shipment. If necessary, the strip is downset and taped before packaging. In a presently preferred process, the metal alloy substrate is 42 alloy (Fe+Ni), and the selective spot plating is silver 100 to 150 microinches thick.

Abstract: Improved apparatus for carrying encapsulated electronic components, having a conveyor belt defined by a horizontal web with a pluraity of identical, flexible tines depending from both sides of the edge of the web. The web is formed into a continuous, endless loop adapted to be carried on a pair of vertical pulleys rotatable on horizontal shafts. Projecting cams, on the face of the web of the belt remote from the dependent tines, engage mating indentations in the periphery of the two pulleys guiding and imparting movement to the belt. The opposing groups of tines are urged apart, by spreader cams, at the beginning and end of the passage of the belt between the lower faces of the two pulleys. Parts to be plated are brought into the space between the tines which, upon exiting from the cams as the conveyor moves entrap the part between them and causing them to move through the plating tanks and treatment stations positioned along the path of the conveyor.