Patents by Inventor Frank J. Mosna, Jr.

Frank J. Mosna, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a mount for electronic devices
    Patent number: 6996897
    Abstract: method for making a mount for at least two electronic devices forming a first mounting surface (210) from a material (240), and forming a second mounting surface (220) from the material (240). The first mounting surface (210) is connected to, but spaced from, the second mounting surface (220) by a mounting surface distance (250). The method further comprises reducing the mounting surface distance (250).
    Type: Grant
    Filed: July 31, 2002
    Date of Patent: February 14, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Frank J. Mosna, Jr., Alexander J. Elliott, William M. Strom
  • Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
    Patent number: 6949816
    Abstract: A semiconductor component for electrical coupling to a substrate (230) includes: a semiconductor chip (110); a non-leaded leadframe (120) including a plurality of electrical contacts (130) located around a periphery (111) of the semiconductor chip; a first electrical conductor (140) electrically coupling together the semiconductor chip and the non-leaded leadframe; and a mold compound (210) disposed around the semiconductor chip, the first electrical conductor, and the plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts includes: a first surface (310) having a first surface area for electrically coupling to the semiconductor chip; and a second surface (320) opposite the first surface and having a second surface area for electrically coupling to the substrate, where the second surface area is larger than the first surface area.
    Type: Grant
    Filed: April 21, 2003
    Date of Patent: September 27, 2005
    Assignee: Motorola, Inc.
    Inventors: Clem H. Brown, Wai Wong Chow, Frank J. Mosna, Jr.
  • Non-contact lead design and package
    Patent number: 5142450
    Abstract: A leadframe having wire bonding zones recessed from the single plane of the upper surface. Heat actuated adhesive tape sandwiched between the leadframe and a heatspreader is heated and the assembly is pressed together to bond the heatspreader to the leadframe without contacting the wire bonding zones.
    Type: Grant
    Filed: April 12, 1991
    Date of Patent: August 25, 1992
    Assignee: Motorola, Inc.
    Inventors: Timothy L. Olson, Frank J. Mosna, Jr.