Abstract: A power electronic interposer (10) for mounting a number of power transistor integrated circuit dice (14) can be made from a multi-layer ceramic process to provide an aluminum nitride body (11) having internal tungsten traces (30-35) to electrically connect die bond pads (17,18) to interposer contact pads (25,26) allowing connection to circuitry off of the interposer. The traces can include one or more groupings of parallely spaced apart conductive vias (30,31) that are connected in an electrically parallel manner to reduce electrical resistance and inductance in the circuitry. A network of cooling conduits and optional resistance temperature detector traces can be run through other parts of the body to provide controlled active cooling. The interposer can be formed separate ceramic bodies bonded together, to package the dice.

Abstract: A multi-layer aluminum nitride ceramic, multi-heating element substrate (11) is provided for forming electrical bonds between integrated circuits (13) and an interposer structure (14) using a thermocompression bonding process. The individually energizable heater element traces (9) can be run through common regions of the heater surface platform (5). A network of cooling vias can be run through other parts of the substrate. The traces are then separately controlled and energized during a predetermined routine resulting in a temperature profile that maintains a substantially constant temperature plateau phase near a reflow temperature, and a more uniform temperature across the spaced apart surface regions of the heater substrate, thus imparting a more precisely uniform heating to the parts being bonded.

Abstract: A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing.

Abstract: A multi-layer aluminum nitride ceramic, multi-heating element substrate is provided for forming electrical bonds between integrated circuits and an interposer structure using a thermocompression bonding process. The individually energizable heater element traces can be run through common regions of the heater surface platform. A network of cooling vias can be run through other parts of the substrate. The traces are then separately controlled and energized during a predetermined routine resulting in a temperature profile that maintains a substantially constant temperature plateau phase near a reflow temperature, and a more uniform temperature across the spaced apart surface regions of the heater substrate, thus imparting a more precisely uniform heating to the parts being bonded.

Abstract: A monolithic, substantially hermetic joining or bonding of two or more aluminum nitride (“AlN”) ceramic components is made by promoting transient liquid phase sintering near the contact areas between the components. In a first approach, AlN particles are combined with a rare earth oxide sintering additive such as yttrium oxide (Y2O3) in a joining paste can be applied between the joining surfaces of fired ceramic preformed components prior to final firing to weld the components together. In a second approach, the additive is added to green mixture, and the components having different shrinkage aspect ratios are mated and cofired in an atmosphere containing a partial pressure of the additive. The additive encourages wetting and diffusion of the liquid phases present on the surfaces of ceramic interface particles in the contact areas during final firing. Such processes can be used to form complex ceramic structures such as a ceramic susceptor used in integrated circuit fabrication.

Abstract: A shaped charged liner for oil well perforating is made from composite metal powder of clusters of pre-agglomerated particles of a denser metal with an agglutinating metal which is press-molded or tap-molded into a near net-shape liner preform which is then sintered to form a sintered body which is hot-coined or forged to form the final shape liner. The powder is formed by different density metal particles which are preclustered.

Abstract: An opto-electronic semiconductor microcircuit chip package where the chip is mounted upon a substrate or boat which in turn is mounted to the floor of the package upon a pool of reflowable solder. Actuator wires connect from package pads to pads on the boat. When the solder is liquefied, the entire package is placed in a magnetic field and current runs through actuator wires in order to force rotation of the boat according to Maxwell's equations for electric current in a magnetic field. The current is adjusted to obtain the proper torque on the boat to move it into alignment with an impinging fiber optic cable. Once in alignment, the solder is cooled to lock the boat in place and in alignment.

Abstract: An hermetically enhanced hybrid microelectronic package of injection moldable plastic and ceramic parts, wherein a gas barrier is formed onto surfaces of the plastic parts through metalization. Further, interface surfaces between the plastic parts and any metal or ceramic parts are further treated to accommodate hermetically stable low temperature bonding such as soldering at a temperature which does not exceed the temperature limits of the plastic.

Abstract: A heatsink assembly and method of fabrication and use for high power RF LDMOS transistors such as those used in mobile telephone basestation pre-antenna amplifiers wherein die attachment to the heatsink flange occurs prior to leadframe/spacer-to-flange bonding. Various bonding methods are disclosed which do not compromise the die-to-flange attachment bond. A unique leadframe/spacer/flange heatsink package is also disclosed which automatically properly orients attachment of the leadframe/spacer to the flange, and provides for a thickened spacer. A unique leadframe having contact projections also avoids later wire bonding. A unique leadframe/spacer/lid combination is disclosed which allows in one step the bonding of the leadframe to the flange, electrically contacting the die, and encapsulation.

Abstract: A ceramic metal matrix composite and copper material having a layer of ceramic metal matrix composite such as aluminum silicon carbide (Al—SiC) bonded to a layer of metal such as copper useful for forming heat-dissipating components for microelectronics concerned with lightweight, high stiffness, high thermal conductivity and compatible thermo expansion characteristics. The clad material may be formed from plurality of sucessive layers of composite and metal. The material is formed by rolling an extruded strip of Al—SiC with the metal layer. Alternately, an interim layer of aluminum, aluminum silicon or other bond-enhancing material is clad to the metal layer prior to rolling it with the composite. The interim layer is thought to form a stronger bond with the exposed aluminum matrix portion of the composites layer.

Abstract: A process for low cost manufacturing light-weight, heat-dissipating structures such as heatsinks, heat spreaders, and covers or lids for microelectronic components such as flip-chip integrated circuits from difficult-to-machine metal matrix composites such as aluminum silicon carbide (generically referred to as “Al—SiC” or “AlSiC”). The process involves selecting a mass produced quantity of Al—SiC material, forming that material into a thin ribbon, then stamping/coining the ribbon into the structures. The ribbon can be formed by extruding a thin strip from a billet of the Al—SiC material, then plurally rolling it. In this way, commonly available AlSiC composites manufactured in high volume for use in other applications such as cast automotive parts may be used.

Abstract: Heat-dissipating microcircuit substrate, having coefficients of thermal expansion adjusted to match the materials of the microcircuit mounted thereupon, are manufactured by powder metallurgy using carbides resulting from the combination of various types of carbons and wetting agents.

Abstract: A homogeneous sintered composite made by press-forming a homogeneous mixture of powders of an agglutinating component, a second component having a melting point higher then the agglutinating component, and an exothermically reactive component to form a compact; heating the compact, then inducing an exothermic reaction of the reactive substance which generates sufficient additional heat to melt the agglutinating component without melting the high melting point component. For electronic microcircuit heat-dissipation applications the agglutinating component is a high thermal conductivity metal, and the high melting point component has a low thermal expansivity, whose proportions are adjusted to match the thermal expansion characteristics of microcircuit material. To reduce porosity, the reacted compact is pressed again while the agglutinating component is still in the liquid phase. For low weight applications the second material has high specific thermal conductivity.

Abstract: High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of an inexpensive high thermal conductivity material having a high coefficient of thermal expansion (CTE) such as copper and at least one other low CTE material such as tungsten, the proportions of which are adjusted to match the CTE of the microcircuit material. The pressed compacts are sintered in order to achieve an homogeneous distribution of the melting copper throughout the structure. A multilevel embodiment of the heatsink comprises two bonded layers of metals or composites having their coefficients of thermal expansion adjusted to match those of the semiconductor material and of any supporting structures respectively, wherein the second layer in contact with the supporting structure has a high CTE and the other has a lower CTE.

Abstract: High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of an inexpensive high thermal conductivity material having a high coefficient of thermal expansion (CTE) such as copper and at least one other low CTE material such as tungsten, the proportions of which are adjusted to match the CTE of the microcircuit material. The pressed compacts are sintered in order to achieve an homogeneous distribution of the melting copper throughout the structure. A multilevel embodiment of the heatsink comprises two bonded layers of metals or composites having their coefficients of thermal expansion adjusted to match those of the semiconductor material and of any supporting structures respectively, wherein the second layer in contact with the supporting structure has a high CTE and the other has a lower CTE.

Abstract: Heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum breakably agglutinated in nodules grouping sub-nodules of surface alloyed pairs of particles of each metal, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1090.degree. C. to 1150.degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.

Abstract: High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1,200.degree. C. to 1,350.degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.