Abstract: Electrically conductive paper is coated with an insulating coating comprising an organic solvent-soluble solution copolymer of monoethylenically unsaturated monomers comprising from about 1% to about 8% of copolymerized acrylamide or a monoethylenic derivative thereof in combination with from 4% to 10% of copolymerized monoethylenically unsaturated carboxylic acid including from 1/4th to 3/4ths of methacrylic acid based on total carboxylic acid monomer.

Abstract: A low temperature curing solution coating composition is disclosed for the protection of solvent-sensitive thermoplastic moldings. In these compositions, a solvent medium consisting essentially of alcoholic solvents has dissolved therein a self-curing solution copolymer of monoethylenically unsaturated monomers containing an ether of an N-methylol functional monomer, especially isobutoxymethyl acrylamide. This solution is catalyzed with from 3% to 12%, based on the weight of the copolymer, of a long chain dialkyl naphthalene disulfonic acid. The catalyzed compositions are stable and cure at 150.degree. F. to 200.degree. F. without damaging the thermoplastic moldings.

Abstract: Electrically conductive paper is coated with an insulating coating which is an aqueous latex of an aqueous emulsion copolymer of monoethylenically unsaturated monomers comprising from 5% to 40% of copolymerized acrylamide or a monoethylenic derivative thereof, preferably isobutoxymethyl acrylamide. A proportion of monoethylenically unsaturated carboxylic acid is preferably included in the copolymer.

Abstract: Electrically conductive paper is coated with an insulating coating to provide improved electrographic properties using a solvent-soluble copolymer comprising from 5% to 40% of copolymerized acrylamide or a monoethylenic derivative thereof. The coating is preferably pigmented with calcium carbonate, and the presence of the copolymerized acrylamide allows an increase in the pigment to binder ratio into the range of from 2:1 to 6:1.

Abstract: A low temperature curing solution coating composition is disclosed for the protection of solvent-sensitive thermoplastic moldings. In these compositions, a solvent medium consisting essentially of alcoholic solvents has dissolved therein a self-curing solution copolymer of monoethylenically unsaturated monomers containing an ether of an N-methylol functional monomer, especially isobutoxymethyl acrylamide. This solution is catalyzed with from 0.5% to 2.0%, based on the weight of the copolymer, of sulfuric acid. The catalyzed compositions are stable and cure at 150.degree. F. to 200.degree. F. without damaging the thermoplastic moldings.