Patents by Inventor Frank J. Venskytis

Frank J. Venskytis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tungsten-copper composite powder
    Patent number: 6103392
    Abstract: A high performance W--Cu composite powder is provided which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
    Type: Grant
    Filed: November 17, 1995
    Date of Patent: August 15, 2000
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Gail T. Meyers, Frank J. Venskytis
  • Tungsten-copper composite powder
    Patent number: 5956560
    Abstract: A high performance W--Cu composite powder which is composed of individual particles having a tungsten phase and a copper phase wherein the tungsten phase substantially encapsulates the copper phase. The tungsten-coated copper composite powder may be pressed and sintered into W--Cu pseudoalloy articles having a homogeneous distribution of W and Cu phases without experiencing copper bleedout or it may be used in ceramic metallization for the electronics industry.
    Type: Grant
    Filed: January 15, 1997
    Date of Patent: September 21, 1999
    Assignee: Osram Sylvania Inc.
    Inventors: Leonid P. Dorfman, David L. Houck, Michael J. Scheithauer, Muktesh Paliwal, Gail T. Meyers, Frank J. Venskytis