Patents by Inventor Frank J. Wall, Jr.

Frank J. Wall, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode for mounting to a heat sink
    Patent number: 7625104
    Abstract: A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.
    Type: Grant
    Filed: December 13, 2007
    Date of Patent: December 1, 2009
    Assignee: Philips Lumileds Lighting Company, LLC
    Inventors: Li Zhang, Frank M. Steranka, Frank J. Wall, Jr., Jeff Kmetec, Johannes Wilhelmus Weekamp
  • Light Emitting Diode for Mounting to a Heat Sink
    Publication number: 20090154166
    Abstract: A light emitting diode (LED) apparatus for mounting to a heat sink having a front surface with an opening therein is disclosed. The apparatus includes a sub-mount, at least one LED die mounted on the sub-mount, and a thermally conductive slug having first and second areas. The first area is thermally coupled to the sub-mount and the second area has a post protruding outwardly therefrom. The post is operably configured to be received in the opening in the heat sink and to secure the LED apparatus to the heat sink such that the second area is thermally coupled to the front surface of the heat sink. Other embodiments for mounting an LED apparatus utilizing adhesive thermally conductive material, spring clips, insertion snaps, or welding are also disclosed.
    Type: Application
    Filed: December 13, 2007
    Publication date: June 18, 2009
    Applicant: PHILIPS LUMILEDS LIGHTING COMPANY, LLC
    Inventors: Li Zhang, Frank M. Steranka, Frank J. Wall, JR., Jeff Kmetec, Johannes Wilhelmus Weekamp