Patents by Inventor Frank K. C. Fan

Frank K. C. Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for fabricating a high density multi-layer microcoil
    Patent number: 7194799
    Abstract: A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.
    Type: Grant
    Filed: April 20, 2004
    Date of Patent: March 27, 2007
    Assignee: Industrial Technology Research Institute
    Inventors: Morris P. F. Liang, Sway Chuang, Frank K. C. Fan, Chen Chung Kao
  • High density multi-layer microcoil and method for fabricating the same
    Patent number: 6876285
    Abstract: A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: April 5, 2005
    Assignee: Industrial Technology Research Institute
    Inventors: Morris P. F. Liang, Sway Chuang, Frank K. C. Fan, Chen Chung Kao
  • High density multi-layer microcoil and method for fabricating the same
    Publication number: 20040196130
    Abstract: A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.
    Type: Application
    Filed: April 20, 2004
    Publication date: October 7, 2004
    Inventors: Morris P.F. Liang, Sway Chuang, Frank K.C. Fan, Chen Chung Kao
  • High density multi-layer microcoil and method for fabricating the same
    Publication number: 20030208900
    Abstract: A high density multi-layer microcoil includes a substrate, a multi-layer coil winding, a magnetic core and a dry film photoresist structure. The multi-layer coil winding and the magnetic core are supported by the dry film photoresist structure. The fabrication process is using photolithography process to form a dry film photoresist structure with a coil tunnel having coil elements perpendicular to the substrate and two outlets at ends of the tunnel; and injecting a conductive material with a low melting point into the tunnel and forming the coil winding.
    Type: Application
    Filed: July 23, 2002
    Publication date: November 13, 2003
    Inventors: Morris P.F. Liang, Sway Chuang, Frank K.C. Fan, Chen Chung Kao