Abstract: The present invention relates to a process for preparing a polymer dispersion foam L, where:a) a mixture M which comprises at least one conjugated diene monomer A and at least one ethylenically unsaturated comonomer B is polymerized by free-radical aqueous emulsion polymerization in the presence of at least one emulsifier to give a fine polymer dispersion P,b) the fine polymer dispersion P is pressure-agglomerated to give a coarse polymer dispersion G,c) the polymer dispersion G is concentrated, if desired, and is mixed, if desired, with a reinforcer dispersion H, andd) the dispersion from c) is foamed to give a polymer dispersion foam L,which comprises adjusting the average particle size and the particle size distribution of G by varying a parameter selected from:I) the solids content of P,II) the agglomeration temperature in step b),III) the agglomeration pressure in step b),IV) the content of comonomer B in the mixture M,V) the concentration of the emulsifier in P,VI) the agglomeration throughput,to polyme

Abstract: An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The cover plate is separated from the integrated circuit by a small space. The cover plate has a pair of ports which allow a thermal grease to be injected into the space between the integrated circuit and the cover plate. The package has a seal that extends around the integrated circuit between the cover plate and the substrate. The seal controls and confines the thermal grease to an area immediately adjacent to the integrated circuit.

Abstract: An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.

Abstract: An integrated circuit package that has no internal routing or vias within the substrate of the package. The package includes a substrate that has a plurality of bond pads and connecting contact pads located on an outer first surface of the substrate. An integrated circuit is mounted to the first surface and coupled to the bond pads. Mounted to the substrate is a solder rack which contains a plurality of contacts that couple the contact pads to an external printed circuit board.

Abstract: An integrated circuit package which has a heat pipe that is incorporated into the body of the package. The package contains an integrated circuit which is mounted to a package substrate. The integrated circuit die is enclosed by a cover plate that is attached to the substrate. The heat pipe is attached to a nut that is screwed into the cover plate. The heat pipe has a bottom surface that is thermally coupled to the die to provide a direct thermal path between the integrated circuit and the heat pipe.

Abstract: A surface mount package for an electronic device has an array of solder shapes or structures projecting from the bottom surface of the package. The solder structures are cast in place on the package substrate using a wave solder process. The solder also fills via holes in the substrate at each solder structure site. An integrated circuit is bonded to the top surface of the substrate using a conventional tape automated bonding (TAB) process or other suitable bonding process. The preferred shape of the solder structure is a cone, but other shapes, including hemispheres, columns and pyramids can be produced using a mold with suitably shaped cavities. The mold is preferably as large as an entire substrate panel so that a large number of device sites can be processed simultaneously.