Patents by Inventor Frank L. Howland

Frank L. Howland has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fabrication of circuit packages
    Patent number: 4352449
    Abstract: A method of fabricating circuit packages which employ macro-components (10) mounted on supporting substrates (20). In order to maintain sufficient clearance between the component and substrate and achieve high reliability bonds, massive solder preforms (16) are applied to contact pads on either the component or substrate. After contact pads of both carrier and substrate are brought into contact with the spheres, the bond is formed.
    Type: Grant
    Filed: December 26, 1979
    Date of Patent: October 5, 1982
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Peter M. Hall, Frank L. Howland, Joseph M. Morabito, Lawrence J. Rickabaugh