Patents by Inventor Frank L. Pompeo
Frank L. Pompeo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11940271Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.Type: GrantFiled: November 17, 2020Date of Patent: March 26, 2024Assignee: International Business Machines CorporationInventors: David J. Lewison, Jay A. Bunt, Frank L. Pompeo, Richard Walter Oldrey, John D. Sylvestri, Phong T. Tran
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Publication number: 20220347327Abstract: Apparatuses and methods of fabrication are provided which include a coolant-cooled heat sink through which coolant passes to facilitate cooling the coolant-cooled heat sink, and an ultra-violet (UV) light assembly associated with the coolant-cooled heat sink for directing UV light towards an interior surface of the coolant-cooled heat sink across which the coolant passes. The UV light inhibits bacterial growth at the interior surface of the coolant-cooled heat sink.Type: ApplicationFiled: April 30, 2021Publication date: November 3, 2022Inventors: Hongqing ZHANG, David J. LEWISON, Frank L. POMPEO, James BUSBY, Jay A. BUNT, Joyce E. MOLINELLI ACOCELLA, Madhana SUNDER, Michael J. ELLSWORTH, JR.
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Patent number: 11404287Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: GrantFiled: December 22, 2020Date of Patent: August 2, 2022Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
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Publication number: 20220155049Abstract: A method of preparing a computer processor die includes determining a warpage shape of the computer processor die at a testing temperature. The method also includes selectively contouring a thickness of the computer processor die at a contouring temperature by physically removing material from a surface of the computer processor die such that the surface will be substantially flat at the testing temperature.Type: ApplicationFiled: November 17, 2020Publication date: May 19, 2022Inventors: David J. Lewison, Jay A. Bunt, Frank L. Pompeo, Richard Walter Oldrey, John D. Sylvestri, Phong T. Tran
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Patent number: 11156409Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.Type: GrantFiled: January 20, 2020Date of Patent: October 26, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hongqing Zhang, Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey Allen Zitz
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Publication number: 20210222956Abstract: Coolant-cooled heat sinks and methods of fabrication are provided with a coolant-carrying compartment between a cover and a heat transfer base. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. One or more grooves are provided in an interface surface of the cover and fins, and wicking element(s) are positioned within, at least in part, the groove(s). A joining material is provided between the cover and fins to join the plurality of thermally-conductive fins to the cover. The wicking element(s) within, at least in part, the groove(s) facilitate retaining the joining material over the plurality of thermally-conductive fins during joining of the cover and fins.Type: ApplicationFiled: January 20, 2020Publication date: July 22, 2021Inventors: Hongqing ZHANG, Jay A. BUNT, David J. LEWISON, Joyce E. MOLINELLI ACOCELLA, Frank L. POMPEO, Jeffrey Allen ZITZ
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Publication number: 20210111037Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: ApplicationFiled: December 22, 2020Publication date: April 15, 2021Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
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Patent number: 10978313Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: GrantFiled: February 20, 2018Date of Patent: April 13, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Phillip D. Isaacs, Christopher M. Marroquin, Daren Simmons, Frank L. Pompeo, Jason R. Eagle, Mark K. Hoffmeyer, Michael J. Ellsworth, Jr., Prabjit Singh, Steve Ostrander
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Patent number: 10842043Abstract: Methods of producing coolant-cooled heat sinks with a coolant-carrying compartment between a cover and a heat transfer base are provided. The heat transfer base includes a heat transfer surface to couple to a component to be cooled, and a plurality of thermally-conductive fins extending into the coolant-carrying compartment from a surface of the heat transfer base opposite to the heat transfer surface. The method includes positioning a screen with openings over the plurality of thermally-conductive fins, between the plurality of thermally-conductive fins and the cover, and providing a joining material over the screen, between the screen and the cover. The method also includes joining the plurality of thermally-conductive fins to the cover across the screen using the joining material, where the screen facilitates retaining the joining material over the plurality of thermally-conductive fins during the joining.Type: GrantFiled: November 11, 2019Date of Patent: November 17, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Hongqing Zhang, David J. Lewison, Jay A. Bunt, Joyce Molinelli Acocella, Jeffrey Allen Zitz, Frank L. Pompeo
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Patent number: 10750615Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: GrantFiled: May 28, 2019Date of Patent: August 18, 2020Assignee: International Business Machines CorporationInventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Publication number: 20190281702Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: ApplicationFiled: May 28, 2019Publication date: September 12, 2019Inventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Publication number: 20190259632Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: ApplicationFiled: February 20, 2018Publication date: August 22, 2019Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
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Patent number: 10368441Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: GrantFiled: March 22, 2018Date of Patent: July 30, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Publication number: 20180213645Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: ApplicationFiled: March 22, 2018Publication date: July 26, 2018Inventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Patent number: 9974179Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: GrantFiled: March 22, 2017Date of Patent: May 15, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Publication number: 20170196089Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: ApplicationFiled: March 22, 2017Publication date: July 6, 2017Inventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Patent number: 9627784Abstract: An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly.Type: GrantFiled: December 1, 2015Date of Patent: April 18, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi, Marie-Claude Paquet, Frank L. Pompeo, David L. Questad, James Speidell, Sri M. Sri-Jayantha, Son K. Tran
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Patent number: 8492199Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.Type: GrantFiled: October 4, 2011Date of Patent: July 23, 2013Assignee: International Business Machines CorporationInventors: Jeffrey T. Coffin, Steven P. Ostrander, Frank L. Pompeo, Jiali Wu
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Publication number: 20120021567Abstract: The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) containing a plurality of chips on a substrate which chips are underfilled with a reworkable composition which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross-linkable and when cured form a cross-linked domain in the base resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.Type: ApplicationFiled: October 4, 2011Publication date: January 26, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Jeffrey T. Coffin, Steven P. Ostrander, Frank L. Pompeo, Jiali Wu
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Patent number: 7900809Abstract: A method for assembling, and the resultant electronic module, includes attaching a chip to a substrate using a first solder interconnection array, and attaching a board to the substrate using a second solder interconnection array, which may be a single-melt or a dual-melt solder array. The second solder interconnection array resides entirely within a space defined between the board and substrate. A creep resistant structure is provided within this space for maintaining the defined space and optimizing integrity of the second solder interconnection array. The creep resistant structure may include an underfill material, balls, brackets, frames, collars or combinations thereof. Wherein the creep resistant structure is an underfill material, it is crucial that the substrate be attached to the board before either entirely encapsulating the second interconnection array with underfill material, or partially encapsulating the second solder interconnection array at discrete locations with underfill material.Type: GrantFiled: June 26, 2008Date of Patent: March 8, 2011Assignee: International Business Machines CorporationInventors: Glenn G. Daves, David L. Edwards, Mukta G. Farooq, Frank L. Pompeo