Abstract: A method of reducing a concentration of hydrogen peroxide from wastewater includes diluting the wastewater with water having a lower concentration of hydrogen peroxide than the wastewater to produce a diluted wastewater, contacting the diluted wastewater with a dissolved iron compound at an acidic pH to form a partially treated wastewater having a lower concentration of hydrogen peroxide than the diluted wastewater, and precipitating iron solids from the partially treated wastewater by raising a pH of the partially treated wastewater to form a neutralized partially treated wastewater.

Abstract: A method of reducing a concentration of hydrogen peroxide from wastewater includes diluting the wastewater with water having a lower concentration of hydrogen peroxide than the wastewater to produce a diluted wastewater, contacting the diluted wastewater with a dissolved iron compound at an acidic pH to form a partially treated wastewater having a lower concentration of hydrogen peroxide than the diluted wastewater, and precipitating iron solids from the partially treated wastewater by raising a pH of the partially treated wastewater to form a neutralized partially treated wastewater.

Abstract: A method of reducing the concentration of dissolved selenium in water includes introducing water having solid selenium-containing particles and a metal that bonds with selenium into a vessel and precipitating a metal-selenium compound from the water. A method of reducing the concentration of dissolved selenium or reducing dissolution of dissolved selenium, including providing a source of electrons into the water to precipitate dissolved selenium compounds is also disclosed. The precipitated compounds are separated from the water to produce decontaminated water. A system for reducing the concentration of dissolved selenium or reducing dissolution of dissolved selenium is also disclosed. The system includes a vessel fluidly connectable to a water source, at least one solid metal source, and a source of electrical voltage electrically connectable to the metal source.

Abstract: A novel process and apparatus are disclosed for cleaning wastewater containing metal ions in solution, hydrogen peroxide, and high solids, e.g., greater than about 50 mg/l particulate solids. A carbon adsorption column removes hydrogen peroxide in the wastewater feed containing high solids. A ion exchange unit removes the metal ions from solution. The process and apparatus remove metal ions such as copper from a high solids byproduct polishing slurry from the chemical mechanical polishing (CMP) of integrated circuit microchips to form an environmentally clean wastewater discharge.

Abstract: A novel process and apparatus are disclosed for cleaning wastewater containing metal ions in solution, hydrogen peroxide, and high solids, e.g., greater than about 50 mg/l particulate solids. A carbon adsorption column removes hydrogen peroxide in the wastewater feed containing high solids. A ion exchange unit removes the metal ions from solution. The process and apparatus remove metal ions such as copper from a high solids byproduct polishing slurry from the chemical mechanical polishing (CMP) of integrated circuit microchips to form an environmentally clean wastewater discharge.

Abstract: A novel process and apparatus are disclosed for cleaning wastewater containing metal ions in solution, hydrogen peroxide, and high solids, e.g., greater than about 50 mg/l particulate solids. A carbon adsorption column removes hydrogen peroxide in the wastewater feed containing high solids. A chemical precipitation unit removes the metal ions from solution. The process and apparatus remove metal ions such as copper from a high solids byproduct polishing slurry from the chemical mechanical polishing (CMP) of integrated circuit microchips to form an environmentally clean wastewater discharge.