Patents by Inventor Frank Lee

Frank Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11967591
    Abstract: A method of forming a semiconductor device includes forming a first interconnect structure over a carrier; forming a thermal dissipation block over the carrier; forming metal posts over the first interconnect structure; attaching a first integrated circuit die over the first interconnect structure and the thermal dissipation block; removing the carrier; attaching a semiconductor package to the first interconnect structure and the thermal dissipation block using first electrical connectors and thermal dissipation connectors; and forming external electrical connectors, the external electrical connectors being configured to transmit each external electrical connection into the semiconductor device, the thermal dissipation block being electrically isolated from each external electrical connection.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: April 23, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Patent number: 11957919
    Abstract: An implantable system includes an implantable medical device (IMD) and a non-transvenous lead that is configured to be implanted outside of a heart. The IMD includes an output configured to be connected at least to the lead, a current generator (CG) circuit configured to generate pacing pulses, a switching circuit coupled between the CG circuit and the output, one or more capacitors coupled in parallel with the CG circuit and the switching circuit, and a control circuit coupled to the CG circuit. The control circuit is configured to manage the CG circuit to generate the pacing pulses with a constant current at the output.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: April 16, 2024
    Assignee: Pacesetter, Inc.
    Inventors: Reza Shahandeh, Ninous Davoudi, Frank Lee, David Doudna, Jeffery Crook
  • Patent number: 11947445
    Abstract: Systems and methods for adjusting operating parameters of at least one pipelined software asset. Within a pipelined environment, an agent software asset is inserted immediately preceding a software asset whose operating parameters are to be adjusted. The agent software asset receives data and/or data sets from a user and such data and data sets are inserted/used by the software asset. The agent software asset also allows for a reporting of the output of other software assets to thereby provide users with intermediate outputs from the pipelined environment.
    Type: Grant
    Filed: February 17, 2023
    Date of Patent: April 2, 2024
    Assignee: MCKINSEY & COMPANY, INC.
    Inventors: Pedro Miguel Vilhena da Maia de Sá E Menezes, Andreas Raggl, Ryan Edward Luque Maas, Andreas Kremer, Frank Rainer Alfons Herbert Gerhard, Pankaj Kumar, Marie-Paule Laurent, Michelle Atwood, Justin Lee Gibbs
  • Publication number: 20240104124
    Abstract: A system, method and computer product for managing distributed transactions of a database. A transaction manager is provided for each of a plurality of transactions of the database. Each transaction manager is configured to perform functions that include generating a transaction token that specifies data to be visible for a transaction on the database. The database contains both row and column storage engines, and the transaction token includes a transaction identifier (TID) for identifying committed transactions and uncommitted transactions. A last computed transaction is designated with a computed identifier (CID), record-level locking of records of the database is performed using the TID and CID to execute the transaction, and the plurality of transactions of the database are executed with each transaction manager.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Frank Renkes, Juchang Lee
  • Publication number: 20240090086
    Abstract: The present disclosure relates to a cartridge for an aerosol delivery device such as a smoking article. The cartridge may include a base, a reservoir substrate, and an atomizer. The reservoir substrate may define a cavity therethrough. The atomizer may comprise a liquid transport element and a heating element extending at least partially about the liquid transport element. The atomizer may extend through the cavity through the reservoir substrate such that the heating element is positioned proximate an end of the reservoir substrate. Ends of the liquid transport element may extend to an opposing end of the reservoir substrate. A related method for assembling a cartridge for a smoking article is also provided.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: John DePiano, David Smith, Charles Jacob Novak, III, Frank S. Silveira, Steven Lee Alderman, Grady Lance Dooly, Frederic Philippe Ampolini, Timothy Brian Nestor, Quentin Paul Guenther, JR., Stephen Benson Sears, John William Wolber, Michael Laine
  • Patent number: 11929340
    Abstract: A structure includes a redistribution structure, which includes a bottom layer and a plurality of upper layers over the bottom layer. The redistribution structure also includes a power-ground macro extending from a topmost layer in the plurality of upper layers to a bottommost layer in the plurality of upper layers, and a metal pad in the bottom layer and overlapped by the power-ground macro. The metal pad is electrically disconnected from the power-ground macro.
    Type: Grant
    Filed: August 4, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Ting-Yu Yeh, Chun-Hua Chang, Fong-Yuan Chang, Jyh Chwen Frank Lee
  • Patent number: 11921760
    Abstract: A system, method and computer product for managing distributed transactions of a database. A transaction manager is provided for each of a plurality of transactions of the database. Each transaction manager is configured to perform functions that include generating a transaction token that specifies data to be visible for a transaction on the database. The database contains both row and column storage engines, and the transaction token includes a transaction identifier (TID) for identifying committed transactions and uncommitted transactions. A last computed transaction is designated with a computed identifier (CID), record-level locking of records of the database is performed using the TID and CID to execute the transaction, and the plurality of transactions of the database are executed with each transaction manager.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: March 5, 2024
    Assignee: SAP SE
    Inventors: Frank Renkes, Juchang Lee
  • Patent number: 11915127
    Abstract: A system includes first, second and third input data sets. The first input data set includes demographic information characterizing a patient. The second and third input data sets characterize a healthcare treatment history of the patient. A neural network includes first, second and third neural subnetworks. The first neural subnetwork is configured to process the first input data set to produce a first output data set. The second neural subnetwork is configured to process the second input data set to produce a second output data set. The third neural subnetwork is configured to process the third input data set to produce a third output data set. An autoencoder layer has an input layer comprising the first, second and third output data sets and is configured to process the first, second and third output data sets to produce a secondary output data set.
    Type: Grant
    Filed: August 3, 2019
    Date of Patent: February 27, 2024
    Assignee: Edifecs, Inc.
    Inventors: Kanaka Prasad Saripalli, Frank Lucas Wolcott, Paul Raymond Dausman, Shailly Saxena, William Lee Clements
  • Publication number: 20240028820
    Abstract: Certain applications analyze data using a spreadsheet/tabular format consisting of rows and columns with a plurality of cells. Each column has a header that describes the content of the cells in that column. Spreadsheets are particularly suited to the storage or large amounts of information that can be evaluated and analyzed. However, one of the challenges of storing large amounts of date in a spreadsheet format is that the analysis of the data can be overwhelming without a visual reference. This application allows its user to “visualize” the information in a spreadsheet and to manipulate that data visually through the use of icons that can be moved on the screen. Changes made using this visual editor appear as changes to the data in the spreadsheet and changes to the data made using the spreadsheet are reflected in the visual editor. The visual editor can extend the capability of existing spreadsheets and enable online collaboration, for example during online meetings.
    Type: Application
    Filed: July 19, 2022
    Publication date: January 25, 2024
    Inventor: Frank Lee
  • Publication number: 20240021441
    Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.
    Type: Application
    Filed: July 24, 2023
    Publication date: January 18, 2024
    Inventors: Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen
  • Patent number: 11845643
    Abstract: Among other things, beverages are dispensed from one or more beverage dispensers based on selections made by users. Information about the dispensing of the beverages is sent to a central server where it is used to manage a variety of functions including replacement of depleted supplies of components. Various features of the beverage dispensers enable the beverages that are dispensed to be uniform and appealing to users.
    Type: Grant
    Filed: May 4, 2018
    Date of Patent: December 19, 2023
    Assignee: Hydration Labs, Inc.
    Inventors: Michael Wing, Yvan De Boeck, Sean Grundy, Elizabeth Becton, Frank Lee
  • Patent number: 11842946
    Abstract: Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: December 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Xinyu Bao, Lee-Chung Lu, Jyh Chwen Frank Lee, Fong-yuan Chang, Sam Vaziri, Po-Hsiang Huang
  • Patent number: 11832940
    Abstract: Systems, methods, and apparatuses for enabling a plurality of non-invasive, physiological sensors to obtain physiological measurements from essentially the same, overlapping, or proximate regions of tissue of a patient are disclosed. Each of a plurality of sensors can be integrated with or attached to a multi-sensor apparatus and can be oriented such that each sensor is directed towards, or can obtain a measurement from, the same or a similar location.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: December 5, 2023
    Assignee: Cercacor Laboratories, Inc.
    Inventors: Mohamed K. Diab, Kevin Hughes Pauley, Jesse Chen, Cristiano Dalvi, Hung The Vo, Ferdyan Lesmana, Jeroen Poeze, Ruiqi Long, Venkatramanan Krishnamani, Frank Lee
  • Publication number: 20230387078
    Abstract: A semiconductor device includes an integrated passive device coupled to a redistribution structure by a plurality of first bumps, and having a plurality of second bumps disposed opposite the plurality of first bumps, wherein the plurality of first and second bumps are thermally and/or electrically connected, and thus enable further thermal and/or electrical connections within or comprising the semiconductor device.
    Type: Application
    Filed: May 25, 2022
    Publication date: November 30, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fong-yuan Chang, Ho Che Yu, Yu-Hao Chen, Yii-Chian Lu, Ching-Yi Lin, Jyh Chwen Frank Lee
  • Patent number: 11817324
    Abstract: A method includes forming a package, which includes forming a plurality of redistribution lines over a carrier, and forming a thermal dissipation block over the carrier. The plurality of redistribution lines and the thermal dissipation block are formed by common processes. The thermal dissipation block has a first metal density, and the plurality of redistribution lines have a second metal density smaller than the first metal density. The method further includes forming a metal post over the carrier, placing a device die directly over the thermal dissipation block, and encapsulating the device die and the metal post in an encapsulant. The package is then de-bonded from the carrier.
    Type: Grant
    Filed: July 9, 2021
    Date of Patent: November 14, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ching-Yi Lin, Yu-Hao Chen, Fong-Yuan Chang, Po-Hsiang Huang, Jyh Chwen Frank Lee, Shuo-Mao Chen
  • Publication number: 20230223379
    Abstract: A semiconductor device includes a first substrate. The semiconductor device includes a plurality of metallization layers formed over the first substrate. The semiconductor device includes a plurality of via structures formed over the plurality of metallization layers. The semiconductor device includes a second substrate attached to the first substrate through the plurality of via structures. The semiconductor device includes a first conductive line disposed in a first one of the plurality of metallization layers. The first conductive line, extending along a first lateral direction, is connected to at least a first one of the plurality of via structures that is in electrical contact with a first through via structure of the second substrate, and to at least a second one of the plurality of via structures that is laterally offset from the first through via structure.
    Type: Application
    Filed: May 27, 2022
    Publication date: July 13, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Fong-Yuan Chang, Ching-Yi Lin, Po-Hsiang Huang, Ho Che Yu, Jyh Chwen Frank Lee
  • Patent number: 11690787
    Abstract: A drug transfer adapter includes a body having a first end and a second end positioned opposite the first end, a transfer spike extending from the body and defining an opening, with the transfer spike configured to pierce a closure of a container, a connector extending from the body, and a securing member extending from the body. The securing member has a first side and a second side positioned opposite the first side, with the first side of the securing member including an adhesive surface configured to secure the body to a container.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: July 4, 2023
    Assignee: Becton, Dickinson and Company
    Inventor: Frank Lee
  • Publication number: 20230172119
    Abstract: An apparatus for facilitating cultivation of plants. The apparatus comprises a top enclosure, a bottom enclosure, a vertical column, a cover, a tray, sensors, environmental actuators, a nutrition container, and a processing device. Further, the top enclosure houses a first component. Further, the bottom enclosure houses a second component. Further, the vertical column is interspersed between the top enclosure and the bottom enclosure is forming an interior space therebetween. Further, the cover is interspersed between the top enclosure and the bottom enclosure, encloses the interior space and allows light to enter from a surrounding of the apparatus into the interior space. Further, the tray holds a plant. Further, the sensors generate sensor data representing variables. Further, the environmental actuators control environmental variables. Further, the nutrition container contains a nutritional medium. Further, the processing device controls the environmental actuators based on the sensor data.
    Type: Application
    Filed: November 30, 2022
    Publication date: June 8, 2023
    Inventor: Sai Kong Frank Lee
  • Publication number: 20230117009
    Abstract: A method includes: receiving a layout of an integrated circuit; identifying, based on the layout, at least a first net and at least a second net, wherein the first net extends through the integrated circuit along a vertical direction, and the second net terminates at a middle portion of the integrated circuit along the vertical direction; dividing the integrated circuit into a plurality of grid units, wherein the first net is constituted by a first subset of the plurality of grid units, and the second net is constituted by a second subset of the plurality of grid units; estimating a first thermal conductivity of each of the first subsets of grid units; estimating a second thermal conductivity of each of the second subsets of grid units; and estimating an equivalent thermal conductivity of the integrated circuit based on combining the first thermal conductivity and the second thermal conductivity.
    Type: Application
    Filed: February 11, 2022
    Publication date: April 20, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ching-Yi Lin, Fong-yuan Chang, Po-Yu Chen, Po-Hsiang Huang, Chih-Wei Chang, Jyh Chwen Frank Lee
  • Patent number: D1023781
    Type: Grant
    Filed: January 7, 2021
    Date of Patent: April 23, 2024
    Assignee: The Procter & Gamble Company
    Inventors: Sun-Jan Alan Huang, Mark Robert Sivik, Frank William Denome, Christopher Lee Haun