Abstract: An improved alloy especially suitable for soldering aluminum to aluminum or aluminum to other metals which has a base containing bismuth, lead and/or cadmium to which is added the following in small amounts: silver, antimony, cobalt, copper, manganese and nickel. The resulting alloy has a melting and flowing temperature below 550.degree. F. and exhibits improved resistance to interface corrosion by virtue of an intermetallic compound layer formed at the interface.