Abstract: In a cleaning apparatus, a boil sump containing a cleaning solvent within four sidewalls and a bottom. Additionally, the boil sump has a partition extending between two opposing sidewalls that separates the boil sump into a boiling compartment and a cleaning compartment. Furthermore, the partition contains a conduit therethrough that permits the solvent to flow between the cleaning and boiling compartments. The boiling compartment contains a heater that heats the solvent to a boil while the cleaning compartment contains an ultrasonic transducer array for ultrasonically cleaning an object placed in the cleaning compartment. In addition to the boil sump, the cleaning apparatus contains a rinsing compartment for rinsing an object that has been cleaned in the cleaning compartment. The boil sump, as well as the rinsing compartment, are contained in a single, enclosed chamber within the cleaning apparatus.