Patents by Inventor Frank Ma
Frank Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11952551Abstract: The presently claimed invention relates to a gear oil composition having a kinematic viscosity at 40° C. in the range of ?68 to ?1000 cSt when measured in accordance with ASTM D445. The gear oil composition is useful as a lubricant in a gear box, especially in a wind turbine gear box.Type: GrantFiled: December 18, 2019Date of Patent: April 9, 2024Assignee: BASF SEInventors: Qinggao Ma, Rene Koschabek, Philippe Rabbat, Henrik Heinemann, Karolin Monz, Frank Rittig, Nawid Kashani, Markus Scherer
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Patent number: 8764476Abstract: The transmission connector includes a base, a flexible circuit board and a cover. The base has a fixing seat with bendable tongues and a receiving seat. The flexible circuit board is received in the fixing seat and the receiving seat with abutting against the tongues. The cover includes a contact seat coupled to the fixing seat and having insulation-displacement contacts (IDCs). Bottoms of the IDCs are in contact with the flexible circuit board. The tongues generate elasticity force to push the flexible circuit board, so that the flexible circuit board can keep in electric contact with the IDCs.Type: GrantFiled: December 6, 2012Date of Patent: July 1, 2014Inventor: Frank Ma
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Publication number: 20140162489Abstract: The transmission connector includes a base, a flexible circuit board and a cover. The base has a fixing seat with bendable tongues and a receiving seat. The flexible circuit board is received in the fixing seat and the receiving seat with abutting against the tongues. The cover includes a contact seat coupled to the fixing seat and having insulation-displacement contacts (IDCs). Bottoms of the IDCs are in contact with the flexible circuit board. The tongues generate elasticity force to push the flexible circuit board, so that the flexible circuit board can keep in electric contact with the IDCs.Type: ApplicationFiled: December 6, 2012Publication date: June 12, 2014Inventor: Frank MA
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Publication number: 20140102488Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.Type: ApplicationFiled: December 11, 2013Publication date: April 17, 2014Applicant: Intermolecular, Inc.Inventors: Satbir Kahlon, Frank Ma
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Patent number: 8647446Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.Type: GrantFiled: December 7, 2011Date of Patent: February 11, 2014Assignee: Intermolecular, Inc.Inventors: Satbir Kahlon, Frank Ma
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Publication number: 20130146103Abstract: A method and system for cleaning a substrate in a multi-module cleaning assembly is provided. The method begins by receiving the substrate into the cleaning module. A cleaning chemistry, at a temperature elevated from an ambient temperature, is applied onto a top surface of the substrate. Concurrent with application of the cleaning chemistry, vapors are exhausted from the cleaning chemistry through a port located below a bottom surface of the substrate with the vapor exhaustion providing a negative pressure relative to a pressure external to the cleaning module. The application of the cleaning chemistry is terminated, followed by termination of the exhausting of the vapors. The substrate is dried after the flowing of inert gas is terminated.Type: ApplicationFiled: December 7, 2011Publication date: June 13, 2013Applicant: Intermolecular, Inc.Inventors: Satbir Kahlon, Frank Ma
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Publication number: 20130133701Abstract: Methods for cleaning a substrate are provided. One such method includes receiving the substrate into a cleaning module and flowing an inert gas into the cleaning module. The flowing of the inert gas includes flowing the inert gas into an inlet defined within a top surface of the cleaning module and modifying a direction of the flowing inert gas to flow radially along the top surface of the cleaning module. Concurrent with or after initiating the flowing of the inert gas, a cleaning chemistry is introduced onto a surface of the substrate. The cleaning chemistry is at a temperature elevated from an ambient temperature. The dispensing of the cleaning chemistry is terminated and the flowing of the inert gas is terminated either concurrent with or after termination of the dispensing of the cleaning chemistry. The substrate is dried after the termination of the flowing of the inert gas.Type: ApplicationFiled: November 28, 2011Publication date: May 30, 2013Applicant: Intermolecular, Inc.Inventors: Satbir Kahlon, Frank Ma
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Publication number: 20090257904Abstract: A method of pressing a powder metal compact comprising partially filling a die cavity with powder metal, engaging a second die with the first die, extending radially inwardly punches for forming a transverse feature in the compact, filling the die cavity with powder metal, compressing the powder metal with a punch, relieving pressure on the compact, withdrawing the radially inwardly punches so as to allow axial movement of the compact, withdrawing the second die, and ejecting the compact from the die while simultaneously filling the die cavity.Type: ApplicationFiled: April 11, 2008Publication date: October 15, 2009Inventors: Roger Lawcock, Mark Haiko, Frank Ma
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Patent number: 6739898Abstract: A telecommunication connector includes a housing, a circuit board mounted in the housing and holding a set of communication terminals and a set of connection terminals, the connection terminals being obliquely aligned at the circuit board in a staggered manner, reducing cross-talk, a wire block mounted on the circuit board to a communication line in connection to the connection terminals, the wire block having a guide plate in the wire hole thereof and connected between two locating walls and sloping forwardly downwards form a guide space for guiding the bare wires of the communication line into respective terminal grooves at an equal distance to ensure stable communication quality, and two movable covers pivoted to the housing and adapted to hold down the wire block and to protect the circuit board and the connection terminals against external dust.Type: GrantFiled: August 27, 2003Date of Patent: May 25, 2004Assignee: Hsing Chau Industrial Co., Ltd.Inventors: Frank Ma, Martin Lin
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Patent number: 6318986Abstract: This invention relates to a device to compact parts with an undercut out of powder material having an upper die moveable relative a lower die, at least one upper punch associated with the upper die for relative movement therebetween, at least two lower punches associated with the lower die for relative movement therebetween, the lower punches defining a lower cavity with the lower die for filling with the powder material when the dies are in an open position, the upper die contacting the lower die in a closed position for movement of one of the lower punches towards the upper die so as to transfer the powder material towards the upper die and then to compact the powder material between the upper and lower punches with said dies in the closed position so as to produce the part; the dies moveable to an eject position for ejection of the compacted part.Type: GrantFiled: July 20, 1998Date of Patent: November 20, 2001Assignee: Stackpole LimitedInventors: Gerd Hinzmann, Mark Haiko, Frank Ma, Allan Wilson, Keith Buckley-Golder, Robert Round
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Patent number: 6120728Abstract: This invention relates to a device to compact parts with an undercut out of powder metal, including a pair of dies linearly moveable relative to one another and then phased, and an associated linearly displaceable pair of punches to produce said parts with said undercut.Type: GrantFiled: November 5, 1997Date of Patent: September 19, 2000Assignee: Stackpole LimitedInventors: Gerd Hinzmann, Mark Haiko, Keith Bukley-Golder, Robert Round, Alan Wilson, Frank Ma
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Patent number: 6099772Abstract: This invention relates to a device to compact parts with an undercut out of powder material having an upper die moveable relative a lower die, at least one upper punch associated with the upper die for relative movement therebetween, at least two lower punches associated with said lower die for relative movement therebetween, the lower punches defining a lower cavity with the lower die for filling with the powder material when the dies are in an open position, the upper die contacting the lower die in a closed position for movement of one of the lower punches towards the upper die so as to transfer the powder material towards the upper die and then to compact the powder material between the upper and lower punches with said dies in the closed position so as to produce said part; said dies moveable to an eject position for ejection of the compacted part.Type: GrantFiled: April 18, 1997Date of Patent: August 8, 2000Assignee: Stackpole LimitedInventors: Gerd Hinzmann, Mark Haiko, Frank Ma, Allan Wilson, Keith Buckley-Golder, Robert Round
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Patent number: 5698149Abstract: This invention relates to a device to compact parts with an undercut out of powder metal, including a pair of dies linearly moveable relative to one another and then phased, and an associated linearly displaceable pair of punches to produce said parts with said undercut.Type: GrantFiled: September 11, 1995Date of Patent: December 16, 1997Assignee: Stackpole LimitedInventors: Gerd Hinzmann, Mark Haiko, Frank Ma, Allan Wilson, Keith Buckley-Golder, Robert Round
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Patent number: 5256085Abstract: A receptacle connector (10) includes an insulative housing (12) having a front mating portion (14) projecting from a front face (16) of a flange section (18) and having a mating face (20) in the front. A pair of rows of passageways (70) extend longitudinally within the connector (10) to receive a plurality of corresponding contacts (52, 60) therein, respectively. A central cavity (50) is positioned along the lateral center line and extends inwardly from the mating face (20) for receiving a blade of a complementary plug connector therein. A conductive shield (80) has a shroud adapted to surround the front mating portion (14) wherein the front portion of the shield (80) extends vertically an appropriate distance toward the cavity (50).Type: GrantFiled: November 5, 1992Date of Patent: October 26, 1993Assignee: Foxconn International, Inc.Inventors: Haw-Chan Tan, Frank Ma, Yuan-Chieh Lin
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Patent number: 4954279Abstract: A composition is described which consists of a microemulsion of oil in a water/glycol solution containing certain thickening agents, emulsifiers, substantially water-insoluble, partially polar oils, and alkanolamines to provide the desirable viscosity and shear stability needed to give a composition having effective de-icer and anti-icing properties.Type: GrantFiled: February 8, 1988Date of Patent: September 4, 1990Assignee: Union Carbide CorporationInventors: Frank Ma, Daniel Comeau