Abstract: The invention discloses a device comprising a stack of at least two layers, which may comprise active or passive discrete components, TSOP and/or ball grid array packages, flip chip or wire bonded bare die or the like, which layers are stacked and . interconnected to define an integral module. A first and second layer comprise an electrically conductive trace with one or more electronic components in electrical connection therewith. The electrically conductive traces terminate at a lateral surface of each of the layers to define an access lead. An interposer structure is disposed between the layers and provides an interposer lateral surface upon which a conductive layer interconnect trace is defined to create an electrical connection between predetermined access leads on each of the layers.

Abstract: The invention discloses a device comprising a stack of at least two layers, which may comprise active or passive discrete components, TSOP and/or ball grid array packages, flip chip or wire bonded bare die or the like, which layers are stacked and interconnected to define an integral module. A first and second layer comprise an electrically conductive trace with one or more electronic components in electrical connection therewith. The electrically conductive traces terminate at a lateral surface of each of the layers to define an access lead. An interposer structure is disposed between the layers and provides an interposer lateral surface upon which a conductive layer interconnect trace is defined to create an electrical connection between predetermined access leads on each of the layers.