Abstract: A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.

Abstract: An electrical package, such as a stereo for an automobile comprises a chassis and one or more subassemblies adapted to mate with the chassis. One or more flanges extend from the chassis and each subassembly includes one or more edges each adapted to be securely held in place by one or more of the flanges. Preferably, the flanges and the edges are adapted to mate in sliding engagement with one another. Thus, the electrical package can be assembled without the use of threaded fasteners.

Abstract: A method of forming a circuit board with electronic assemblies lying in different planes, includes providing a single circuit board with entire electronic assemblies pressed thereon. A channel is then formed in the circuit board of a predetermined depth to divide the circuit board into two separate, but integral portions. The circuit board is then bent at a point between the first and second portions of the circuit board such that the second portion of the circuit board can be bent between 0 and 180 degrees with respect to the first portion of the circuit board.

Abstract: An apparatus and method for attaching an electrical component to a convector attached to a chassis of an electrical package is disclosed. The convector comprises one or more slide tracks adapted to receive a spring clamp that provides the sole means for securing a heat-generating component to the convector. The spring clamp includes a flange adapted to be grasped for insertion into the slide tracks, and adapted to cover an opening in the chassis. The spring clamp also includes a pair of prongs, each adapted to fit within one of the slide tracks, and spaced apart from one another so as to capture a rectangular protrusion on the convector therebetween when inserted into the slide tracks. Each prong preferably includes a locking hook that engages the rectangular protrusion.

Abstract: Moisture condensed on a circuit board can cause dendritic growth which can short out a circuit. Such sensitive areas are protected from condensation by filling cavities in an assembly with insulating material to exclude moisture bearing air. Foamed plastic is molded or stamped into shapes which conform to a cavity and are inserted into the assembly. The plastic body is held against the circuit board to preclude condensation on the board. Adhesives and sealants are not required.