Patents by Inventor Frank McPeek

Frank McPeek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6736713
    Abstract: A wafer carrier retaining ring includes a first annular surface that contacts a polishing surface during a polishing process and an inner diameter surface adjoining the first annular surface thereby forming a first annular corner. The first annular corner has a radius in the range of from no less than about 0.010 inches to less than a radius that would result in damage to a wafer being polished. In another embodiment of the invention, a wafer carrier retaining ring includes an inner diameter surface and a second annular surface adjoining said inner diameter surface thereby forming a second annular corner. The second annular corner has a radius of no less than 0.030 inches. In a further embodiment of the invention, a wafer carrier retaining ring is formed of a ceramic material and has a first annular surface having a surface finish of no greater than 2 microinches rms.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: May 18, 2004
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Wayne F. Lougher, Frank McPeek, Robert Key
  • Publication number: 20020037693
    Abstract: A wafer carrier retaining ring includes a first annular surface that contacts a polishing surface during a polishing process and an inner diameter surface adjoining the first annular surface thereby forming a first annular corner. The first annular corner has a radius in the range of from no less than about 0.010 inches to less than a radius that would result in damage to a wafer being polished. In another embodiment of the invention, a wafer carrier retaining ring includes an inner diameter surface and a second annular surface adjoining said inner diameter surface thereby forming a second annular corner. The second annular corner has a radius of no less than 0.030 inches. In a further embodiment of the invention, a wafer carrier retaining ring is formed of a ceramic material and has a first annular surface having a surface finish of no greater than 2 microinches rms.
    Type: Application
    Filed: August 7, 2001
    Publication date: March 28, 2002
    Inventors: Wayne F. Lougher, Frank McPeek, Robert Key