Abstract: Formulation comprising hydrophobicized particles of silicon dioxide, mineral oil and one or more emulsifiers, where the hydrophobicized silicon dioxide is a fumed silicon dioxide, possesses a BET surface area of 200 to 300 m2/g, has on the surface of the particles O—Si—(CnH2n+1)3 groups, where n is 1 to 3 and where the (CnH2n+1) units are alike or different, has a carbon content of 1.5% to 5% by weight, based on the hydrophobic silicon dioxide, and is present in the formulation with a fraction of 0.05% to 5% by weight.

Abstract: A processing aid is used in the processing of thermoplastic polyurethanes to give various articles including a self-supporting film. The processing aid contains a) 10-50% by weight of hydrophobized, at least partially aggregated, metal oxide particles selected from the group consisting of aluminium oxide, silicon dioxide and mixtures thereof, b) 20-75% by weight of one or more thermoplastic polyurethanes, c) 0.5-25% by weight of one or more isocyanates, d) 0.5-15% by weight of one or more compounds which act as lubricant and dispersant, the sum of the constituents a) to d) amounting to at least 90% by weight, based on a total weight of said processing aid.

Abstract: Thermoplastic matrix/compound, comprising thermoplastic polymer and silanised, structurally modified, pyrogenically produced silica.

Abstract: Pyrogenic titanium dioxide is compressed to slugs by preliminarily deaerating it, compressing it to slugs, and crushing the slugs and optionally classifying them. The slugs are characterized by a tamped density (to DIN EN ISO 787-11) of 500 to 1200 g/l.

Abstract: Disclosed are a process for producing a suspension of hydrophobic oxidic particles which has a defined, adjustable viscosity, which comprises suspending low structured hydrophobic oxidic particles in at least one organic suspension agent and then adding from 0.05% to 15% by weight based on the suspension medium of high structured hydrophobic oxidic particles, a suspension of hydrophobic oxidic particles which has a defined, adjustable viscosity and the use thereof for producing soil and water repellent coatings on articles.

Abstract: An aqueous dispersion having a pH value of between 3 and 7 containing 1 to 35 wt. % of a pyrogenically produced silicon-aluminium mixed oxide powder with a specific surface area of 5 to 400 m2/g, wherein the proportion of aluminium oxide in the powder is between 90 and 99.9 wt. % or between 0.01 and 10 wt. %, the surface of the powder comprises zones of aluminium oxide and silicon dioxide and the powder exhibits no signals for crystalline silicon dioxide in an X-ray diffractogram. Said dispersion may be used for the chemical-mechanical polishing of conductive, metallic films.

Abstract: Aqueous dispersion containing a silicon-aluminum mixed oxide powder, the powder containing 0.1 to 99.9 wt. % Al2O3 and Si—O—Al-bonds. The dispersion can be produced using dispersing and/or grinding devices which a achieve an energy input of at least 200 KJ/m3. The dispersion can be used for the chemical-mechanical polishing of semiconductor substrates.

Abstract: Disclosed are a process for producing a suspension of hydrophobic oxidic particles which has a defined, adjustable viscosity, which comprises suspending low structured hydrophobic oxidic particles in at least one organic suspension agent and then adding from 0.05% to 15% by weight based on the suspension medium of high structured hydrophobic oxidic particles, a suspension of hydrophobic oxidic particles which has a defined, adjustable viscosity and the use thereof for producing soil and water repellent coatings on articles.

Abstract: The invention is directed to sodium percarbonate particles with improved storage stability. The particles are characterized by the presence of small amounts of hydrophobised finely divided oxides on their surface.

Abstract: Aqueous dispersion containing a silicon-aluminum mixed oxide powder, the powder containing 0.1 to 99.9 wt. % Al2O3 and Si—O—Al-bonds. The dispersion can be produced using dispersing and/or grinding devices which a achieve an energy input of at least 200 KJ/m3. The dispersion can be used for the chemical-mechanical polishing of semiconductor substrates.